Novel packaging technology for high-g MEMS accelerometer

Standard IC (Integrated Circuit) package has been adopted in traditional system-level packaging of MEMS devices, such as plastic packages, shell packages of ceramic and shell packages of TO metal. Ceramic shell is easily broken due to the causes such as: the impact of high-g sensors is relatively high; large residual stress remains after thermoplastic encapsulation; shell of TO series is too large and pin is easily broken under the impact of more than 5 × 10³g owing to the line installation. In response, this paper presents a new package method for MEMS accelerometer, which adopts glass-silicon-glass structure at wafer level and introduces an aluminum shell filled with two-component epoxy resin at system level. There are many advantages of the accelerometer after package, such as small volume, strong sealing, little residual stress, high-impact resistance, good stability, and suitable for small batch production, etc.