Noncyclic Scheduling of Multi-cluster Tools with Multi-Type Wafers Based on Pareto Optimization

Yuanyuan Yan; Qinghua Tao; Huangang Wang; Wenhui Fan

doi:10.1109/ICCAE51876.2021.9426127

Noncyclic Scheduling of Multi-cluster Tools with Multi-Type Wafers Based on Pareto Optimization

Yuanyuan Yan
, Qinghua Tao
, Huangang Wang
, Wenhui Fan

Tsinghua University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Citations (Scopus)

Abstract

In semiconductor manufacturing, multi-cluster tools are widely used. Recently, the variety of wafer types has attracted increasing interests due to the demand of diversification and efficiency in industrial production. In this paper, we focus on the noncyclic scheduling problem of multi-Type wafers in multicluster tools. Firstly, a universal model is constructed to describe such problem for both single-Armed and dual-Armed robots. Correspondingly, an improved dynamic programming algorithm is proposed based on Pareto optimization, in which a renumber rule and a normalization rule are introduced to merge redundant states and further increase the searching efficiency. Theoretical analysis of computational efficiency is also discussed. Numerical experiments verify the effectiveness of the proposed algorithm in minimizing makespan on the noncyclic scheduling with multi-Type wafers.

Original language	English
Title of host publication	2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	95-99
Number of pages	5
ISBN (Electronic)	9780738132204
DOIs	https://doi.org/10.1109/ICCAE51876.2021.9426127
Publication status	Published - 20 Mar 2021
Externally published	Yes
Event	13th International Conference on Computer and Automation Engineering, ICCAE 2021 - Virtual, Melbourne, United States Duration: 20 Mar 2021 → 22 Mar 2021

Publication series

Name	2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021

Conference

Conference	13th International Conference on Computer and Automation Engineering, ICCAE 2021
Country/Territory	United States
City	Virtual, Melbourne
Period	20/03/21 → 22/03/21

Keywords

Multi-Cluster Tools
Multi-Type Wafers Pareto Optimization
Noncyclic Scheduling

Access to Document

10.1109/ICCAE51876.2021.9426127

Cite this

Yan, Y., Tao, Q., Wang, H., & Fan, W. (2021). Noncyclic Scheduling of Multi-cluster Tools with Multi-Type Wafers Based on Pareto Optimization. In 2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021 (pp. 95-99). Article 9426127 (2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICCAE51876.2021.9426127

Yan, Yuanyuan ; Tao, Qinghua ; Wang, Huangang et al. / Noncyclic Scheduling of Multi-cluster Tools with Multi-Type Wafers Based on Pareto Optimization. 2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021. Institute of Electrical and Electronics Engineers Inc., 2021. pp. 95-99 (2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021).

@inproceedings{dac1978249644884bedfed74ed9dcee3,

title = "Noncyclic Scheduling of Multi-cluster Tools with Multi-Type Wafers Based on Pareto Optimization",

abstract = "In semiconductor manufacturing, multi-cluster tools are widely used. Recently, the variety of wafer types has attracted increasing interests due to the demand of diversification and efficiency in industrial production. In this paper, we focus on the noncyclic scheduling problem of multi-Type wafers in multicluster tools. Firstly, a universal model is constructed to describe such problem for both single-Armed and dual-Armed robots. Correspondingly, an improved dynamic programming algorithm is proposed based on Pareto optimization, in which a renumber rule and a normalization rule are introduced to merge redundant states and further increase the searching efficiency. Theoretical analysis of computational efficiency is also discussed. Numerical experiments verify the effectiveness of the proposed algorithm in minimizing makespan on the noncyclic scheduling with multi-Type wafers.",

keywords = "Multi-Cluster Tools, Multi-Type Wafers Pareto Optimization, Noncyclic Scheduling",

author = "Yuanyuan Yan and Qinghua Tao and Huangang Wang and Wenhui Fan",

note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 13th International Conference on Computer and Automation Engineering, ICCAE 2021 ; Conference date: 20-03-2021 Through 22-03-2021",

year = "2021",

month = mar,

day = "20",

doi = "10.1109/ICCAE51876.2021.9426127",

language = "English",

series = "2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "95--99",

booktitle = "2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021",

address = "United States",

}

Yan, Y, Tao, Q, Wang, H & Fan, W 2021, Noncyclic Scheduling of Multi-cluster Tools with Multi-Type Wafers Based on Pareto Optimization. in 2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021., 9426127, 2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021, Institute of Electrical and Electronics Engineers Inc., pp. 95-99, 13th International Conference on Computer and Automation Engineering, ICCAE 2021, Virtual, Melbourne, United States, 20/03/21. https://doi.org/10.1109/ICCAE51876.2021.9426127

Noncyclic Scheduling of Multi-cluster Tools with Multi-Type Wafers Based on Pareto Optimization. / Yan, Yuanyuan; Tao, Qinghua; Wang, Huangang et al.
2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 95-99 9426127 (2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Noncyclic Scheduling of Multi-cluster Tools with Multi-Type Wafers Based on Pareto Optimization

AU - Yan, Yuanyuan

AU - Tao, Qinghua

AU - Wang, Huangang

AU - Fan, Wenhui

PY - 2021/3/20

Y1 - 2021/3/20

N2 - In semiconductor manufacturing, multi-cluster tools are widely used. Recently, the variety of wafer types has attracted increasing interests due to the demand of diversification and efficiency in industrial production. In this paper, we focus on the noncyclic scheduling problem of multi-Type wafers in multicluster tools. Firstly, a universal model is constructed to describe such problem for both single-Armed and dual-Armed robots. Correspondingly, an improved dynamic programming algorithm is proposed based on Pareto optimization, in which a renumber rule and a normalization rule are introduced to merge redundant states and further increase the searching efficiency. Theoretical analysis of computational efficiency is also discussed. Numerical experiments verify the effectiveness of the proposed algorithm in minimizing makespan on the noncyclic scheduling with multi-Type wafers.

AB - In semiconductor manufacturing, multi-cluster tools are widely used. Recently, the variety of wafer types has attracted increasing interests due to the demand of diversification and efficiency in industrial production. In this paper, we focus on the noncyclic scheduling problem of multi-Type wafers in multicluster tools. Firstly, a universal model is constructed to describe such problem for both single-Armed and dual-Armed robots. Correspondingly, an improved dynamic programming algorithm is proposed based on Pareto optimization, in which a renumber rule and a normalization rule are introduced to merge redundant states and further increase the searching efficiency. Theoretical analysis of computational efficiency is also discussed. Numerical experiments verify the effectiveness of the proposed algorithm in minimizing makespan on the noncyclic scheduling with multi-Type wafers.

KW - Multi-Cluster Tools

KW - Multi-Type Wafers Pareto Optimization

KW - Noncyclic Scheduling

UR - https://www.scopus.com/pages/publications/85106758251

U2 - 10.1109/ICCAE51876.2021.9426127

DO - 10.1109/ICCAE51876.2021.9426127

M3 - Conference contribution

AN - SCOPUS:85106758251

T3 - 2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021

SP - 95

EP - 99

BT - 2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 13th International Conference on Computer and Automation Engineering, ICCAE 2021

Y2 - 20 March 2021 through 22 March 2021

ER -

Yan Y, Tao Q, Wang H, Fan W. Noncyclic Scheduling of Multi-cluster Tools with Multi-Type Wafers Based on Pareto Optimization. In 2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021. Institute of Electrical and Electronics Engineers Inc. 2021. p. 95-99. 9426127. (2021 13th International Conference on Computer and Automation Engineering, ICCAE 2021). doi: 10.1109/ICCAE51876.2021.9426127

Noncyclic Scheduling of Multi-cluster Tools with Multi-Type Wafers Based on Pareto Optimization

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