@inproceedings{5b76b48780174e01bc535dd54ab54b5f,
title = "Network properties and latency of triple-based hierarchical interconnection netrwork",
abstract = "A new chip design paradigm called Network on Chip (NOC) offers a promising architectural choice for future SOC (System-on-Chip). Triple-based Hierarchical Interconnection Network (THIN) was proposed that aims to decrease the node degree, reduce the links and shorten the diameter. The topology of THIN is very simple and it has obviously hierarchical, symmetric and scalable characteristic. In this paper, the network properties and zero-load latency are studied and compared with 2-D mesh. The compare results show that THIN is a better candidate for constructing the NOC than 2-D Mesh, when there are not too many nodes.",
keywords = "Interconnection architecture, Network properties, Network topology, Network-on-chip",
author = "Baojun Qiao and Feng Shi and Wedxing Ji and Hong Song",
year = "2007",
doi = "10.1109/ICCA.2007.4376501",
language = "English",
isbn = "1424408180",
series = "2007 IEEE International Conference on Control and Automation, ICCA",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "976--979",
booktitle = "2007 IEEE International Conference on Control and Automation, ICCA",
address = "United States",
note = "2007 IEEE International Conference on Control and Automation, ICCA ; Conference date: 30-05-2007 Through 01-06-2007",
}