TY - GEN
T1 - Multiple-Layer Waveguide Terahertz Reconfigurable Integration Platform
AU - He, Zhongxia Simon
AU - Liu, Chenyi
AU - Ding, Biao
AU - Wu, Peng
AU - Yu, Weihua
AU - Zhou, Ziqiao
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - The fabrication of terahertz (THz) waveguides demands exceptionally high tolerance, posing significant challenges to scalable manufacturing. To address this, various electromagnetic bandgap (EBG) structures have been explored for their potential to mitigate fabrication sensitivity. Among these, the integration of higher symmetry configurations emerges as a compelling strategy, offering both enhanced manufacturability and improved electromagnetic performance. In this study, we introduce the Multiple-Layer Waveguide (MLW) architecture, which leverages symmetry-induced robustness to reduce processing costs by up to two orders of magnitude without compromising functional integrity. Building on the theoretical framework of Higher Symmetry Electromagnetic Bandgap (HSEBG), we present a novel low-loss THz interconnection technology that is both reconfigurable and fabrication-friendly. This advancement culminates in the proposal of the THz Reconfigurable Integration Platform (TRIP), a versatile solution poised to accelerate the deployment of next-generation THz systems.
AB - The fabrication of terahertz (THz) waveguides demands exceptionally high tolerance, posing significant challenges to scalable manufacturing. To address this, various electromagnetic bandgap (EBG) structures have been explored for their potential to mitigate fabrication sensitivity. Among these, the integration of higher symmetry configurations emerges as a compelling strategy, offering both enhanced manufacturability and improved electromagnetic performance. In this study, we introduce the Multiple-Layer Waveguide (MLW) architecture, which leverages symmetry-induced robustness to reduce processing costs by up to two orders of magnitude without compromising functional integrity. Building on the theoretical framework of Higher Symmetry Electromagnetic Bandgap (HSEBG), we present a novel low-loss THz interconnection technology that is both reconfigurable and fabrication-friendly. This advancement culminates in the proposal of the THz Reconfigurable Integration Platform (TRIP), a versatile solution poised to accelerate the deployment of next-generation THz systems.
KW - Multiple-Layer Waveguide (MLW)
KW - THz reconfigurable platform (TRIP)
KW - higher symmetry electromagnetic bandgap (HSEBG)
UR - https://www.scopus.com/pages/publications/105034607966
U2 - 10.1109/CSRSWTC67757.2025.11384618
DO - 10.1109/CSRSWTC67757.2025.11384618
M3 - Conference contribution
AN - SCOPUS:105034607966
T3 - Proceedings - 2025 Cross Strait Radio Science and Wireless Technology Conference, CSRSWTC 2025
BT - Proceedings - 2025 Cross Strait Radio Science and Wireless Technology Conference, CSRSWTC 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2025 Cross Strait Radio Science and Wireless Technology Conference, CSRSWTC 2025
Y2 - 14 November 2025 through 16 November 2025
ER -