Multifunctional boron-carbide epoxy resin composites with X-band specific absorption

With the dual demands of flexible electronic packaging and electromagnetic wave protection, this study innovatively develops a thermally responsive multifunctional boron carbide (B₄C)/epoxy resin composite material with electromagnetic wave loss capabilities, demonstrating potential applications in the semiconductor field. When the mass fraction of B₄C reaches 10 wt%, the composite achieves a minimum reflection loss of −45.54 dB and an effective absorption bandwidth of up to 8.3 GHz, enabling ultra-wideband electromagnetic wave absorption. Furthermore, the incorporation of inorganic B₄C particles enhances the glass transition temperature and provides improved mechanical strength to the composite. In addition, this multifunctional epoxy resin material exhibits thermal-induced and electromagnetic wave-induced shape memory, enabling comprehensive protection for flexible electronic devices.