TY - JOUR
T1 - Multi-scale simulation and microstructure characteristics of TC4 ELI/Al 6013 plates by explosive welding
AU - Zhou, Jianan
AU - Luo, Ning
AU - Liang, Hanliang
AU - Sun, Weifu
N1 - Publisher Copyright:
© 2024 The Society of Manufacturing Engineers
PY - 2024/8/30
Y1 - 2024/8/30
N2 - The utilization of Ti/Al alloy composites is widespread in industrial applications owing their exceptional performance characteristics. In this study, the successful preparation of TC4 ELI/Al 6013 bimetallic composites was achieved using explosive welding technology. Electron Probe X-ray Micro Analyzer (EPMA) and Electron Backscatter Diffraction (EBSD) tests were conducted to reveal the microstructure characteristics and elemental diffusion of the bonding interface. Based on multi-scale simulation, the evolution characteristics of the bonding interface were studied. The results of the study indicated that the bonding interface exhibited a typical wavy structure without observable defects, with the average width of the diffusion layer measuring approximately 2.53 μm. During the high strain rate impact process, the grains at the bonding interface underwent a certain degree of grain refinement. TC4 ELI primarily displayed a deformed structure, while Al 6013 exhibited predominantly a recrystallized structure. The morphology and structure of the bonding interface obtained from Smoothed Particle Hydrodynamics (SPH) simulation were consistent with experimental results. Additionally, the thickness of the diffusion layer, deduced from Molecular Dynamics (MD) simulation results, fell within the range of 1.9123–2.7044 μm, corresponding to the results of characterization tests.
AB - The utilization of Ti/Al alloy composites is widespread in industrial applications owing their exceptional performance characteristics. In this study, the successful preparation of TC4 ELI/Al 6013 bimetallic composites was achieved using explosive welding technology. Electron Probe X-ray Micro Analyzer (EPMA) and Electron Backscatter Diffraction (EBSD) tests were conducted to reveal the microstructure characteristics and elemental diffusion of the bonding interface. Based on multi-scale simulation, the evolution characteristics of the bonding interface were studied. The results of the study indicated that the bonding interface exhibited a typical wavy structure without observable defects, with the average width of the diffusion layer measuring approximately 2.53 μm. During the high strain rate impact process, the grains at the bonding interface underwent a certain degree of grain refinement. TC4 ELI primarily displayed a deformed structure, while Al 6013 exhibited predominantly a recrystallized structure. The morphology and structure of the bonding interface obtained from Smoothed Particle Hydrodynamics (SPH) simulation were consistent with experimental results. Additionally, the thickness of the diffusion layer, deduced from Molecular Dynamics (MD) simulation results, fell within the range of 1.9123–2.7044 μm, corresponding to the results of characterization tests.
KW - Explosive welding
KW - Interface microstructure
KW - Multiscale simulation
KW - TC4 ELI/Al 6013 composite
UR - http://www.scopus.com/inward/record.url?scp=85198006009&partnerID=8YFLogxK
U2 - 10.1016/j.jmapro.2024.07.014
DO - 10.1016/j.jmapro.2024.07.014
M3 - Article
AN - SCOPUS:85198006009
SN - 1526-6125
VL - 124
SP - 1180
EP - 1192
JO - Journal of Manufacturing Processes
JF - Journal of Manufacturing Processes
ER -