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Multi-Degree-of-Freedom Electrothermal Microgripper Based on Al-Polyimide Bimorph Structures

  • Beijing Institute of Technology
  • Ministry of Education in China

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Efficient and precise manipulation of micro-targets is essential for advancing micro-assembly applications. This paper presents an electrothermal microgripper integrated with a multi-degree-of-freedom platform, enabling over 600 μ m of vertical displacement and approximately 10° of out-of-plane deflection. These capabilities significantly enhance manipulation efficiency compared to traditional systems that rely on external platforms. The actuator features an Al-Photosensitive Polyimide (PSPI) bimorph structure, which improves both deformation capability and robustness. Experimental results demonstrate that the microgripper can efficiently manipulate a chip capacitor (with a size of 1 × 0.5 × 0.2 mm3, a mass of about 0.6 mg). These characteristics underscore its strong potential for micro-assembly, providing a novel solution for handling diverse micro-targets in complex assembly tasks.

Original languageEnglish
Title of host publication2026 IEEE 39th International Conference on Micro Electro Mechanical Systems, MEMS 2026
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages911-914
Number of pages4
ISBN (Electronic)9798331572518
DOIs
Publication statusPublished - 2026
Externally publishedYes
Event39th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2026 - Salzburg, Austria
Duration: 25 Jan 202629 Jan 2026

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference39th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2026
Country/TerritoryAustria
CitySalzburg
Period25/01/2629/01/26

Keywords

  • Bimorph
  • Electrothermal Microgripper
  • MEMS
  • Manipulation
  • Photosensitive Polyimide

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