TY - GEN
T1 - Multi-Degree of Freedom and Large Scan Range Electrothermal Micromirror Integrated with Thermal Convection-Based Mirror Plate Position Sensors
AU - Ren, Anrun
AU - Ding, Yingtao
AU - Yang, Hengzhang
AU - Zhang, Ziyue
AU - Zhao, Hui
AU - Xie, Huikai
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - In this work, we demonstrate a novel electrothermal micromirror integrated with thermal convection-based mirror-plate position sensors. The micromirror can generate multiple degree-of-freedom (DOF) motions including piston displacement and dual-axis angular scanning. The piston displacement can reach 400 μm, and the optical scan angles along x-axis and y-axis are up to 35° and 29°, respectively, at only 6 Vdc. Quasi-static measurements show that the sensitivities of the position sensors in piston displacement and angular scans along x-axis and y-axis are 0.7 mV/μm, 5.1 mV/°, and 4.7 mV/°, respectively.
AB - In this work, we demonstrate a novel electrothermal micromirror integrated with thermal convection-based mirror-plate position sensors. The micromirror can generate multiple degree-of-freedom (DOF) motions including piston displacement and dual-axis angular scanning. The piston displacement can reach 400 μm, and the optical scan angles along x-axis and y-axis are up to 35° and 29°, respectively, at only 6 Vdc. Quasi-static measurements show that the sensitivities of the position sensors in piston displacement and angular scans along x-axis and y-axis are 0.7 mV/μm, 5.1 mV/°, and 4.7 mV/°, respectively.
KW - electrothermal actuation
KW - Electrothermal micromirror
KW - position sensor
KW - thermal convection
UR - http://www.scopus.com/inward/record.url?scp=105001666100&partnerID=8YFLogxK
U2 - 10.1109/MEMS61431.2025.10917554
DO - 10.1109/MEMS61431.2025.10917554
M3 - Conference contribution
AN - SCOPUS:105001666100
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 1059
EP - 1062
BT - 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems, MEMS 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 38th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2025
Y2 - 19 January 2025 through 23 January 2025
ER -