Modelling of spall damage in ductile materials and its application to the simulation of the plate impact on copper

Feng Guo Zhang*, Hong Qiang Zhou, Jun Hu, Jian Li Shao, Guang Ca Zhang, Tao Hong, Bin He

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)

Abstract

A statistical model of dynamic spall damage due to void nucleation and growth is proposed for ductile materials under intense loading, which takes into account inertia, the elastic-plastic effect, and initial void size. To some extent, void interaction could be accounted for in this approach. Based on this model, the simulation of spall experiments for copper is performed by using the Lagrangian finite element method. The simulation results are in good agreement with experimental data for the free surface velocity profile, stress record behind copper target, final porosity, and void concentrations across the target. The influence of elastic-plastic effect upon the damage evolution is explored. The correlation between the damage evolution and the history of the stress near the spall plane is also analyzed.

Original languageEnglish
Article number094601
JournalChinese Physics B
Volume21
Issue number9
DOIs
Publication statusPublished - Sept 2012
Externally publishedYes

Keywords

  • ductile materials
  • free surface velocity
  • plate impact
  • spall damage

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