Modeling of curing process and residual stress analysis of thick-section thermosetting composites

Yongshan Li, Guangchang Chen, Jingran Ge*, Kai Liu, Jun Liang*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

The curing behavior of composites significantly influences their performance, making it crucial to understand the curing process. This study experimentally measured specific heat capacity, thermal conductivity, glass transition temperature, coefficient of thermal expansion, and cure shrinkage of materials. A simulation model of its curing deformation was established and validated against strain data obtained from fiber Bragg grating experiments. The effects of thickness, heating rate, and cooling rate on the curing temperature field and residual stress field during the molding of thick-section composite plates were analyzed.

Translated title of the contribution厚截面热固性复合材料固化过程建模及残余应力分析
Original languageEnglish
Article number424411
JournalActa Mechanica Sinica/Lixue Xuebao
Volume42
Issue number1
DOIs
Publication statusPublished - Jan 2026

Keywords

  • Curing Behavior
  • Residual stress field
  • Thick-section composite

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