@inproceedings{8845dd7064074e24821fab6c8df381c3,
title = "Modeling and characteristic of the vertical bonding-wire interconnection in Ka-band",
abstract = "This paper announced a new type of bonding interconnect - vertical bonding interconnect. Bonding interconnect is the critical technique for realizing the interconnection of microwave chip. The height, distance, number of wires and joint space of bonding interconnect have important effects on its microwave characteristics. In this paper, commercial 3D electromagnetic analysis software HFSS, microwave circuit design software ADS and Agilent vector network analyzer were used to model, simulate and optimize for the microwave characteristics of bonding interconnect, and produce the model, experimental results shown in this paper.",
keywords = "Microwave chip, Stacked die package, Vertical bonding wire interconnection",
author = "Dawei An and Xiang Li and Jinchao Mou and Xin Lv",
year = "2008",
doi = "10.1109/GSMM.2008.4534607",
language = "English",
isbn = "9781424418855",
series = "2008 Global Symposium on Millimeter Waves, Proceeding, GSMM 2008",
publisher = "IEEE Computer Society",
pages = "229--232",
booktitle = "2008 Global Symposium on Millimeter Waves, Proceeding, GSMM 2008",
address = "United States",
note = "2008 Global Symposium on Millimeter Waves, GSMM 2008 ; Conference date: 21-04-2008 Through 24-04-2008",
}