Microstructure and aging resistance of the joints between SAC305 solder and thermoelectric materials with different diffusion barriers

F. J. Cheng; Z. L. Ma; Y. Wang; G. X. Zhang; W. M. Long

doi:10.4149/km_2014_3_157

Microstructure and aging resistance of the joints between SAC305 solder and thermoelectric materials with different diffusion barriers

F. J. Cheng, Z. L. Ma^*, Y. Wang, G. X. Zhang, W. M. Long

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

The microstructure and aging resistance of SAC305 soldering joints with different diffusion barriers in thermoelectric application were investigated in this paper. Results indicate that the SACPNi joints (SAC305 solder and p-type (Bi,Sb)₂Te₃ thermoelectric materials with Ni diffusion barrier) exhibit more defects when increasing the aging temperature and time. However, there were less defects observed in the SACPSB joints (SAC305 solder and p-type (Bi,Sb)₂Te₃ thermoelectric materials with Sn-58Bi alloy diffusion barrier) when aging temperature and time increased. This result indicated that, for p-type (Bi,Sb)₂Te₃ thermoelectric materials, the diffusion barrier of hot-dipping Sn-58Bi alloy was more preferable than electroless plating nickel in the application of joining p-type thermoelectric materials and the Cu substrates with SAC305 solder.

Original language	English
Pages (from-to)	157-162
Number of pages	6
Journal	Kovove Materialy
Volume	52
Issue number	3
DOIs	https://doi.org/10.4149/km_2014_3_157
Publication status	Published - 2014
Externally published	Yes

Keywords

Aging resistance
Soldering joints
Thermoelectric materials

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10.4149/km_2014_3_157

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title = "Microstructure and aging resistance of the joints between SAC305 solder and thermoelectric materials with different diffusion barriers",

abstract = "The microstructure and aging resistance of SAC305 soldering joints with different diffusion barriers in thermoelectric application were investigated in this paper. Results indicate that the SACPNi joints (SAC305 solder and p-type (Bi,Sb)2Te3 thermoelectric materials with Ni diffusion barrier) exhibit more defects when increasing the aging temperature and time. However, there were less defects observed in the SACPSB joints (SAC305 solder and p-type (Bi,Sb)2Te3 thermoelectric materials with Sn-58Bi alloy diffusion barrier) when aging temperature and time increased. This result indicated that, for p-type (Bi,Sb)2Te3 thermoelectric materials, the diffusion barrier of hot-dipping Sn-58Bi alloy was more preferable than electroless plating nickel in the application of joining p-type thermoelectric materials and the Cu substrates with SAC305 solder.",

keywords = "Aging resistance, Soldering joints, Thermoelectric materials",

author = "Cheng, {F. J.} and Ma, {Z. L.} and Y. Wang and Zhang, {G. X.} and Long, {W. M.}",

year = "2014",

doi = "10.4149/km_2014_3_157",

language = "English",

volume = "52",

pages = "157--162",

journal = "Kovove Materialy",

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publisher = "Institute of Materials and Machine Mechanics, Slovak Academy of Sciences",

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TY - JOUR

T1 - Microstructure and aging resistance of the joints between SAC305 solder and thermoelectric materials with different diffusion barriers

AU - Cheng, F. J.

AU - Ma, Z. L.

AU - Wang, Y.

AU - Zhang, G. X.

AU - Long, W. M.

PY - 2014

Y1 - 2014

N2 - The microstructure and aging resistance of SAC305 soldering joints with different diffusion barriers in thermoelectric application were investigated in this paper. Results indicate that the SACPNi joints (SAC305 solder and p-type (Bi,Sb)2Te3 thermoelectric materials with Ni diffusion barrier) exhibit more defects when increasing the aging temperature and time. However, there were less defects observed in the SACPSB joints (SAC305 solder and p-type (Bi,Sb)2Te3 thermoelectric materials with Sn-58Bi alloy diffusion barrier) when aging temperature and time increased. This result indicated that, for p-type (Bi,Sb)2Te3 thermoelectric materials, the diffusion barrier of hot-dipping Sn-58Bi alloy was more preferable than electroless plating nickel in the application of joining p-type thermoelectric materials and the Cu substrates with SAC305 solder.

AB - The microstructure and aging resistance of SAC305 soldering joints with different diffusion barriers in thermoelectric application were investigated in this paper. Results indicate that the SACPNi joints (SAC305 solder and p-type (Bi,Sb)2Te3 thermoelectric materials with Ni diffusion barrier) exhibit more defects when increasing the aging temperature and time. However, there were less defects observed in the SACPSB joints (SAC305 solder and p-type (Bi,Sb)2Te3 thermoelectric materials with Sn-58Bi alloy diffusion barrier) when aging temperature and time increased. This result indicated that, for p-type (Bi,Sb)2Te3 thermoelectric materials, the diffusion barrier of hot-dipping Sn-58Bi alloy was more preferable than electroless plating nickel in the application of joining p-type thermoelectric materials and the Cu substrates with SAC305 solder.

KW - Aging resistance

KW - Soldering joints

KW - Thermoelectric materials

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U2 - 10.4149/km_2014_3_157

DO - 10.4149/km_2014_3_157

M3 - Article

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SN - 0023-432X

VL - 52

SP - 157

EP - 162

JO - Kovove Materialy

JF - Kovove Materialy

IS - 3

ER -

Microstructure and aging resistance of the joints between SAC305 solder and thermoelectric materials with different diffusion barriers

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Keywords

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