Microendoscopic confocal imaging probe based on an LVD microlens scanner

Ankur Jain; Huikai Xie

doi:10.1109/JSTQE.2007.893112

Microendoscopic confocal imaging probe based on an LVD microlens scanner

Ankur Jain^*
, Huikai Xie

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

17 Citations (Scopus)

Abstract

This paper reports a microendoscopic confocal imaging probe based on a large-vertical-displacement (LVD) microlens scanner. Photoresist reflow technique is used to form a microlens on a lens holder that is integrated with a LVD microactuator. With a footprint of 3 mm × the LVD microlens scanner can vertically displace the integrated polymer microlens by 0.7 mm at a dc voltage of 23 V. The LVD microlens chip is directly packaged into a 5-mm-diameter imaging probe. The architecture of the imaging probe is very simple and is just composed of this microlens, a GRIN rod lens (Ø1.8 mm), a metal mold, and a cover.

Original language	English
Pages (from-to)	228-234
Number of pages	7
Journal	IEEE Journal of Selected Topics in Quantum Electronics
Volume	13
Issue number	2
DOIs	https://doi.org/10.1109/JSTQE.2007.893112
Publication status	Published - Mar 2007
Externally published	Yes

Keywords

Electrothermal actuation
Large vertical displacement (LVD)
Microactuators
Microelectromechanical systems (MEMS)
Optical confocal microscopy
Optical scanners

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10.1109/JSTQE.2007.893112

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title = "Microendoscopic confocal imaging probe based on an LVD microlens scanner",

abstract = "This paper reports a microendoscopic confocal imaging probe based on a large-vertical-displacement (LVD) microlens scanner. Photoresist reflow technique is used to form a microlens on a lens holder that is integrated with a LVD microactuator. With a footprint of 3 mm × the LVD microlens scanner can vertically displace the integrated polymer microlens by 0.7 mm at a dc voltage of 23 V. The LVD microlens chip is directly packaged into a 5-mm-diameter imaging probe. The architecture of the imaging probe is very simple and is just composed of this microlens, a GRIN rod lens ({\O}1.8 mm), a metal mold, and a cover.",

keywords = "Electrothermal actuation, Large vertical displacement (LVD), Microactuators, Microelectromechanical systems (MEMS), Optical confocal microscopy, Optical scanners",

author = "Ankur Jain and Huikai Xie",

year = "2007",

month = mar,

doi = "10.1109/JSTQE.2007.893112",

language = "English",

volume = "13",

pages = "228--234",

journal = "IEEE Journal of Selected Topics in Quantum Electronics",

issn = "1077-260X",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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T1 - Microendoscopic confocal imaging probe based on an LVD microlens scanner

AU - Jain, Ankur

AU - Xie, Huikai

PY - 2007/3

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AB - This paper reports a microendoscopic confocal imaging probe based on a large-vertical-displacement (LVD) microlens scanner. Photoresist reflow technique is used to form a microlens on a lens holder that is integrated with a LVD microactuator. With a footprint of 3 mm × the LVD microlens scanner can vertically displace the integrated polymer microlens by 0.7 mm at a dc voltage of 23 V. The LVD microlens chip is directly packaged into a 5-mm-diameter imaging probe. The architecture of the imaging probe is very simple and is just composed of this microlens, a GRIN rod lens (Ø1.8 mm), a metal mold, and a cover.

KW - Electrothermal actuation

KW - Large vertical displacement (LVD)

KW - Microactuators

KW - Microelectromechanical systems (MEMS)

KW - Optical confocal microscopy

KW - Optical scanners

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DO - 10.1109/JSTQE.2007.893112

M3 - Article

AN - SCOPUS:34247514908

SN - 1077-260X

VL - 13

SP - 228

EP - 234

JO - IEEE Journal of Selected Topics in Quantum Electronics

JF - IEEE Journal of Selected Topics in Quantum Electronics

IS - 2

ER -

Microendoscopic confocal imaging probe based on an LVD microlens scanner

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