TY - GEN
T1 - Mechanism of temperature influence in thickness measurement using eddy current sensors
AU - Li, Zihan
AU - Yuan, Xiuqi
AU - Zhang, Tong
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - Eddy current technology is widely used in micro displacement measurement and conductor surface inspection due to its advantages of non-contact, non-destructive testing, and fast response speed. It also has excellent performance in thin film thickness measurement. However, in practical testing, due to the high sensitivity of eddy current sensors to changes in the thickness of nanoscale thin films, the measurement results are susceptible to temperature changes, leading to a decrease in measurement accuracy. This paper focuses on the issue of temperature stability in the measurement of copper film thickness using eddy current technology. Through the coupling simulation of electromagnetic and temperature fields combined with the analysis of temperature influence mechanism and formula derivation, the influence of temperature changes on the sense coil and copper film is revealed.
AB - Eddy current technology is widely used in micro displacement measurement and conductor surface inspection due to its advantages of non-contact, non-destructive testing, and fast response speed. It also has excellent performance in thin film thickness measurement. However, in practical testing, due to the high sensitivity of eddy current sensors to changes in the thickness of nanoscale thin films, the measurement results are susceptible to temperature changes, leading to a decrease in measurement accuracy. This paper focuses on the issue of temperature stability in the measurement of copper film thickness using eddy current technology. Through the coupling simulation of electromagnetic and temperature fields combined with the analysis of temperature influence mechanism and formula derivation, the influence of temperature changes on the sense coil and copper film is revealed.
KW - Eddy current sensor
KW - film thickness measurement
KW - temperature field
UR - https://www.scopus.com/pages/publications/85182609059
U2 - 10.1109/ICEDCS60513.2023.00094
DO - 10.1109/ICEDCS60513.2023.00094
M3 - Conference contribution
AN - SCOPUS:85182609059
T3 - Proceedings - 2023 International Conference on Electronics and Devices, Computational Science, ICEDCS 2023
SP - 496
EP - 500
BT - Proceedings - 2023 International Conference on Electronics and Devices, Computational Science, ICEDCS 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 International Conference on Electronics and Devices, Computational Science, ICEDCS 2023
Y2 - 22 September 2023 through 24 September 2023
ER -