Low capacitance and highly reliable blind through-silicon-vias (TSVs) with vacuum-assisted spin coating of polyimide dielectric liners

Yang Yang Yan, Miao Xiong, Bin Liu, Ying Tao Ding, Zhi Ming Chen*

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

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Material Science

Engineering