Abstract
Intraoperative monitoring of vascular and hemodynamic status is critical for preventing postoperative complications. However, interpatient variability in vessel geometry renders rigid or pre-shaped implantable sensors inadequate for conformal adaptation to the surgical site. Here, we present an intraoperatively customizable platform for the rapid fabrication of three-dimensional helical vascular electronics via a controlled mechanical peeling strategy. By modulating peeling parameters, helical structures with tunable diameters and pitches are generated, enabling suture-free wrapping around arteries of varying dimensions and branching architectures. Patterned Ag nanofiber electrodes were integrated via a water-assisted transfer method, exhibiting low electrical resistance and exceptional electromechanical stability throughout the peeling process and cyclic vascular pulsation. The obtain helical sensor enables multi-parametric hemodynamic monitoring in vitro models and in vivo rat and rabbit models, capable of detecting intraoperative conditions such as hypertension, vasospasm, and vascular occlusion. These results demonstrate the helical vascular electronics as a versatile intraoperative tool for the timely identification of vascular complications, offering substantial potential to improve surgical outcomes in complex vascular procedures.
| Original language | English |
|---|---|
| Pages (from-to) | 24818-24829 |
| Number of pages | 12 |
| Journal | ACS Nano |
| Volume | 20 |
| Issue number | 36 |
| DOIs | |
| Publication status | Published - 15 Sept 2026 |
| Externally published | Yes |
Keywords
- helical bioelectronics
- hemodynamic monitoring
- intraoperative customization
- mechanical peeling
- vascular complications
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