Interconnect

Yongjun Huo; Yingxia Liu; Fan Yi Ouyang

doi:10.1007/978-981-19-5053-7_6

Interconnect

Yongjun Huo
, Yingxia Liu
, Fan Yi Ouyang^*

^*Corresponding author for this work

School of Material Science and Engineering

City University of Hong Kong
National Tsing Hua University

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

2 Citations (Scopus)

Abstract

Interconnect could provide physical and logical connection between two electronic devices with interconnect with affordable quality and reliability, and thus interconnect is critical for the development of Advanced Driver Assistance Systems (ADAS). In this chapter, interconnects and solder joint technology for applications under the hood are reviewed. In addition, the bonding techniques by using Cu-Cu direct bonding and hybrid bonding are presented.

Original language	English
Title of host publication	Advanced Driver Assistance Systems and Autonomous Vehicles
Subtitle of host publication	From Fundamentals to Applications
Publisher	Springer Nature
Pages	181-212
Number of pages	32
ISBN (Electronic)	9789811950537
ISBN (Print)	9789811950520
DOIs	https://doi.org/10.1007/978-981-19-5053-7_6
Publication status	Published - 1 Jan 2022

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10.1007/978-981-19-5053-7_6

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Interconnect

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