Integrated Thermal Convection-Based Position Sensing for Electrothermal Micromirrors

Anrun Ren, Yingtao Ding, Hengzhang Yang, Teng Pan, Huikai Xie*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Citations (Scopus)

Abstract

This paper serves to demonstrate thermal convection-based sensing as a promising vertical piston displacement and tilt angle sensing mechanism for electrothermal micromirrors. This position sensor consists of one heater located at each of the other two sides of the mirror plate and four thermistors located on the substrate adjacent to each of the heaters on the mirror plate. The position sensor can detect the vertical displacement with a sensitivity of 0.2 mV/μm in the range of 350μm and the tilt angle with a sensitivity of 2.63 mV/° in the range of 20°.

Original languageEnglish
Title of host publication2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages334-337
Number of pages4
ISBN (Electronic)9784886864352
Publication statusPublished - 2023
Event22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023 - Kyoto, Japan
Duration: 25 Jun 202329 Jun 2023

Publication series

Name2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023

Conference

Conference22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
Country/TerritoryJapan
CityKyoto
Period25/06/2329/06/23

Keywords

  • Electrothermal micromirror
  • position sensing
  • thermal convection

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