Abstract
The aim of this study is to examine the effect of substrate surface roughness on the deposition and adhesion properties of electroless Nickel-Phosphorus (Ni-P) plating on 6H-SiC substrates, which is a typical mold material for Precision Glass Molding (PGM). This research investigated the impact of surface roughness at different levels. These levels range from polished surfaces with Ra∼58 nm to non-polished surfaces with Ra∼813 nm, affecting both the electroless Ni-P plating process and the quality of the resulting layers. The study reveals that the initial roughness of the substrate significantly influences the final surface profile of electroless Ni-P plating. This is evidenced by the highest roughness of approximately Ra∼1.32 µm observed on the most uneven substrate. Conversely, substrate characterized by an initial roughness of Ra∼160 nm has a reduced post-plating roughness of Ra∼583 nm and contribute to the smoothness of surface. While the observed surface morphology indicates a decrease in the deposition rates. Additionally, the Rockwell C indentation tests indicate that substrates characterized by lower roughness are susceptible to adhesion difficulties, particularly in the form of peeling at the plating-substrate interface.
Original language | English |
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Article number | 103891 |
Journal | Results in Engineering |
Volume | 25 |
DOIs | |
Publication status | Published - Mar 2025 |
Keywords
- 6H-SiC
- Adhesion strength
- Electroless Ni–P plating
- Precision glass molding
- Surface roughness