In situ high temperature creep deformation of micro-structure with metal film wire on flexible membrane using geometric phase analysis

Qinghua Wang, Satoshi Kishimoto, Huimin Xie*, Zhanwei Liu, Xinhao Lou

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Abstract

A way of measuring the in situ high temperature creep deformation of a micro-structure with a metal film wire on a flexible membrane is developed. The creep deformation measurement of a micro-structure with a Karma alloy wire on a polyimide membrane is used as an application. High temperature gratings were fabricated directly on the surfaces of two Karma alloy wires using the focused ion beam milling technique after the grating frequencies were designed. The grating morphologies with different isothermal soaking time were recorded by a scanning electron microscope with a heating apparatus. The in situ high temperature creep deformations in a micro-region of the structure were measured by performing the geometric phase analysis. The creep behaviors of this structure at 300 °C and 500 °C were analyzed. The developed measurement method is prospective in evaluating the reliability of the film-wire/substrate structures at a high temperature.

Original languageEnglish
Pages (from-to)652-657
Number of pages6
JournalMicroelectronics Reliability
Volume53
Issue number4
DOIs
Publication statusPublished - Apr 2013

Fingerprint

Dive into the research topics of 'In situ high temperature creep deformation of micro-structure with metal film wire on flexible membrane using geometric phase analysis'. Together they form a unique fingerprint.

Cite this