TY - GEN
T1 - Homogenization theory for substrate-integrated metasurface and its applications in scaling of electromagnetic devices
AU - He, Yijing
AU - Li, Yue
AU - Chen, Pai Yen
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/9
Y1 - 2019/9
N2 - We present here the concept, theoretical analysis and applications of the substrate-integrated impedance surface (SIIS). The proposed SIIS, composed of an array of blind-, through-or buried-vias, is embedded in a substrate-integrated waveguide (SIW). The SIIS can be treated as a 2D homogenized surface reactance, which can be reconfigured by adjusting the period and geometry of vias. Such an embedded surface impedance can help tailoring the cutoff frequency, dispersion, resonant frequency, and physical size of SIW-based components. As representative examples, the SIIS loading technique has been exploited to perform wideband control of the waveguide-based epsilon-near-zero (ENZ) supercoupling and to implement a frequency-reconfigurable omnidirectional open cavity antenna.
AB - We present here the concept, theoretical analysis and applications of the substrate-integrated impedance surface (SIIS). The proposed SIIS, composed of an array of blind-, through-or buried-vias, is embedded in a substrate-integrated waveguide (SIW). The SIIS can be treated as a 2D homogenized surface reactance, which can be reconfigured by adjusting the period and geometry of vias. Such an embedded surface impedance can help tailoring the cutoff frequency, dispersion, resonant frequency, and physical size of SIW-based components. As representative examples, the SIIS loading technique has been exploited to perform wideband control of the waveguide-based epsilon-near-zero (ENZ) supercoupling and to implement a frequency-reconfigurable omnidirectional open cavity antenna.
UR - https://www.scopus.com/pages/publications/85074939697
U2 - 10.1109/ICEAA.2019.8878995
DO - 10.1109/ICEAA.2019.8878995
M3 - Conference contribution
AN - SCOPUS:85074939697
T3 - Proceedings of the 2019 21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019
SP - 887
EP - 890
BT - Proceedings of the 2019 21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019
Y2 - 9 September 2019 through 13 September 2019
ER -