TY - GEN
T1 - High Performance Terahertz Metamaterials based on Dynamic Projection Scanning Lithography
AU - Xu, Wenbin
AU - Wang, Bowu
AU - Yu, Weihua
AU - Lin, Chunbo
AU - Liu, Jianzhuo
AU - Lu, Xinji
AU - Xu, Jia
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - T Conventional microfabrication techniques enable micro-and nanoscale structuring but face critical limitations in the precise fabrication of terahertz (THz) metamaterials, especially on large-Area substrates with complex, high-Aspect-ratio features. Traditional lithography struggles to achieve the subwavelength resolution required at THz frequencies, restricting the functionality of such materials. Here, we present a dynamic projection scanning lithography method that integrates frame-by-frame digital light projection with tailored optical configurations for three-dimensional exposure. By employing a cross-scale strategy, the digital micromirror array dynamically adjusts tilt angles and scanning directions, achieving super-resolution beyond conventional projection limits, having a smallest feature size of 2.0 μm. This approach enables precise fabrication of multi-period, sub-pixel THz metamaterial structures across substrates up to 350 × 350 mm2, while flexibly balancing resolution and processing area. The proposed technique offers a versatile platform for high-performance THz metamaterials, with broad potential in ultraprecise manufacturing, micro/nanodevices, integrated optoelectronics, and biosensing.
AB - T Conventional microfabrication techniques enable micro-and nanoscale structuring but face critical limitations in the precise fabrication of terahertz (THz) metamaterials, especially on large-Area substrates with complex, high-Aspect-ratio features. Traditional lithography struggles to achieve the subwavelength resolution required at THz frequencies, restricting the functionality of such materials. Here, we present a dynamic projection scanning lithography method that integrates frame-by-frame digital light projection with tailored optical configurations for three-dimensional exposure. By employing a cross-scale strategy, the digital micromirror array dynamically adjusts tilt angles and scanning directions, achieving super-resolution beyond conventional projection limits, having a smallest feature size of 2.0 μm. This approach enables precise fabrication of multi-period, sub-pixel THz metamaterial structures across substrates up to 350 × 350 mm2, while flexibly balancing resolution and processing area. The proposed technique offers a versatile platform for high-performance THz metamaterials, with broad potential in ultraprecise manufacturing, micro/nanodevices, integrated optoelectronics, and biosensing.
KW - 3D-printing
KW - Digital lithography
KW - Terahertz
KW - component
UR - https://www.scopus.com/pages/publications/105041619070
U2 - 10.1109/ASIM67379.2025.11512667
DO - 10.1109/ASIM67379.2025.11512667
M3 - Conference contribution
AN - SCOPUS:105041619070
T3 - Proceeding of the 2025 4th International Conference on Advanced Sensing and Intelligent Manufacturing, ASIM 2025
BT - Proceeding of the 2025 4th International Conference on Advanced Sensing and Intelligent Manufacturing, ASIM 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 4th International Conference on Advanced Sensing and Intelligent Manufacturing, ASIM 2025
Y2 - 31 October 2025 through 2 November 2025
ER -