High performance integrated passive devices (ipds) on low cost through silicon interposer (LC-TSI)

Cheng Jin, Boyu Zheng, Liang Ding, Rui Li, Kafai Chang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)

Abstract

This paper presents the design, fabrication and characterization of integrated passive devices (IPDs) on low cost through silicon interposer (LC-TSI). The performance of symmetrical spiral inductors is presented and analyzed in this paper. The effect of space between traces and the width of the trace on the Q-factor are studied. In addition, the inductors with TSV around and under are also discussed. On the TSI platform, some radio-frequency (RF) IPDs are also designed, including a millimeter-wave (mmWave) antenna working at 77 GHz for the automotive radar application. A bandpass filter based on the quarter-mode substrate integrated waveguide (QMSIW) is also designed on the TSI platform. The performance of these structures is given and the results show that the TSI platform is an attractive and promising method as a carrier to design IPDs and RF-IPD working at high frequency.

Original languageEnglish
Title of host publicationProceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
Pages840-843
Number of pages4
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013 - Singapore, Singapore
Duration: 11 Dec 201313 Dec 2013

Publication series

NameProceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013

Conference

Conference2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
Country/TerritorySingapore
CitySingapore
Period11/12/1313/12/13

Keywords

  • Bandpass filter (BPF)
  • integrated passive device (IPD)
  • low-cost through silicon interposer (LC-TSI) millimetre-wave (mmWave)

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