High flame retardant and heat-resistance, low dielectric benzoxazine resin with phthalimide structure

Dandan Chen; Benben Liu; Xu Wang; Xiangmei Li; Xingyan Xu; Jiyu He; Rongjie Yang

doi:10.1016/j.polymdegradstab.2022.110150

High flame retardant and heat-resistance, low dielectric benzoxazine resin with phthalimide structure

Dandan Chen
, Benben Liu
, Xu Wang
, Xiangmei Li^*
, Xingyan Xu
, Jiyu He
, Rongjie Yang

^*Corresponding author for this work

School of Material Science and Engineering

Beijing Municipal Center for Building Energy-Efficiency and Building Material Management
Beijing Institute of Technology
National Center for Quality Supervision and Testing of Flame Retardant Materials

Research output: Contribution to journal › Article › peer-review

33 Citations (Scopus)

Abstract

In order to improve the thermal stability, flame retardancy and dielectric properties of benzoxazine resin, benzoxazine resins with different content of 4,4′-‍(hexafluoroisopropylidene) diphthalic dianhydride(m-EFDA) were prepared by crosslinking alkynyl groups. The results showed that benzoxazine can improve the processing window of m-EFDA, while m-EFDA was beneficial to improve the thermal stability and dielectric properties of benzoxazine resins. The T_d5% of PBZFI-50 reached 418.2°C, T_d10% was up to 457.3°C, D_k was 2.89 and D_f was as low as 0.013 at 1MHz. The chemical structures of volatile products from the pyrolysis of benzoxazines resin at different temperatures were identified by TG-FTIR and Py-GC/MS, and the promoting effect of m-EFDA on improving the thermal stability was confirmed. Compared with pure benzoxazine resin, the resin containing m-EFDA has great performance improvement, which is expected to be used as high temperature and low dielectric material in aerospace and microelectronics field.

Original language	English
Article number	110150
Journal	Polymer Degradation and Stability
Volume	205
DOIs	https://doi.org/10.1016/j.polymdegradstab.2022.110150
Publication status	Published - Nov 2022

Keywords

Degradation
Dielectric properties
Flame retardancy
Phthalimide
Polybenzoxazine

Access to Document

10.1016/j.polymdegradstab.2022.110150

Cite this

@article{b944b554d69f45f0b0b8a80bd164fdfa,

title = "High flame retardant and heat-resistance, low dielectric benzoxazine resin with phthalimide structure",

abstract = "In order to improve the thermal stability, flame retardancy and dielectric properties of benzoxazine resin, benzoxazine resins with different content of 4,4′-‍(hexafluoroisopropylidene) diphthalic dianhydride(m-EFDA) were prepared by crosslinking alkynyl groups. The results showed that benzoxazine can improve the processing window of m-EFDA, while m-EFDA was beneficial to improve the thermal stability and dielectric properties of benzoxazine resins. The Td5\% of PBZFI-50 reached 418.2°C, Td10\% was up to 457.3°C, Dk was 2.89 and Df was as low as 0.013 at 1MHz. The chemical structures of volatile products from the pyrolysis of benzoxazines resin at different temperatures were identified by TG-FTIR and Py-GC/MS, and the promoting effect of m-EFDA on improving the thermal stability was confirmed. Compared with pure benzoxazine resin, the resin containing m-EFDA has great performance improvement, which is expected to be used as high temperature and low dielectric material in aerospace and microelectronics field.",

keywords = "Degradation, Dielectric properties, Flame retardancy, Phthalimide, Polybenzoxazine",

author = "Dandan Chen and Benben Liu and Xu Wang and Xiangmei Li and Xingyan Xu and Jiyu He and Rongjie Yang",

note = "Publisher Copyright: {\textcopyright} 2022",

year = "2022",

month = nov,

doi = "10.1016/j.polymdegradstab.2022.110150",

language = "English",

volume = "205",

journal = "Polymer Degradation and Stability",

issn = "0141-3910",

publisher = "Elsevier Ltd.",

}

TY - JOUR

T1 - High flame retardant and heat-resistance, low dielectric benzoxazine resin with phthalimide structure

AU - Chen, Dandan

AU - Liu, Benben

AU - Wang, Xu

AU - Li, Xiangmei

AU - Xu, Xingyan

AU - He, Jiyu

AU - Yang, Rongjie

PY - 2022/11

Y1 - 2022/11

N2 - In order to improve the thermal stability, flame retardancy and dielectric properties of benzoxazine resin, benzoxazine resins with different content of 4,4′-‍(hexafluoroisopropylidene) diphthalic dianhydride(m-EFDA) were prepared by crosslinking alkynyl groups. The results showed that benzoxazine can improve the processing window of m-EFDA, while m-EFDA was beneficial to improve the thermal stability and dielectric properties of benzoxazine resins. The Td5% of PBZFI-50 reached 418.2°C, Td10% was up to 457.3°C, Dk was 2.89 and Df was as low as 0.013 at 1MHz. The chemical structures of volatile products from the pyrolysis of benzoxazines resin at different temperatures were identified by TG-FTIR and Py-GC/MS, and the promoting effect of m-EFDA on improving the thermal stability was confirmed. Compared with pure benzoxazine resin, the resin containing m-EFDA has great performance improvement, which is expected to be used as high temperature and low dielectric material in aerospace and microelectronics field.

AB - In order to improve the thermal stability, flame retardancy and dielectric properties of benzoxazine resin, benzoxazine resins with different content of 4,4′-‍(hexafluoroisopropylidene) diphthalic dianhydride(m-EFDA) were prepared by crosslinking alkynyl groups. The results showed that benzoxazine can improve the processing window of m-EFDA, while m-EFDA was beneficial to improve the thermal stability and dielectric properties of benzoxazine resins. The Td5% of PBZFI-50 reached 418.2°C, Td10% was up to 457.3°C, Dk was 2.89 and Df was as low as 0.013 at 1MHz. The chemical structures of volatile products from the pyrolysis of benzoxazines resin at different temperatures were identified by TG-FTIR and Py-GC/MS, and the promoting effect of m-EFDA on improving the thermal stability was confirmed. Compared with pure benzoxazine resin, the resin containing m-EFDA has great performance improvement, which is expected to be used as high temperature and low dielectric material in aerospace and microelectronics field.

KW - Degradation

KW - Dielectric properties

KW - Flame retardancy

KW - Phthalimide

KW - Polybenzoxazine

UR - https://www.scopus.com/pages/publications/85138451129

U2 - 10.1016/j.polymdegradstab.2022.110150

DO - 10.1016/j.polymdegradstab.2022.110150

M3 - Article

AN - SCOPUS:85138451129

SN - 0141-3910

VL - 205

JO - Polymer Degradation and Stability

JF - Polymer Degradation and Stability

M1 - 110150

ER -

High flame retardant and heat-resistance, low dielectric benzoxazine resin with phthalimide structure

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this