Heat transfer performance simulation of double-layer trapezoidal microchannel heat sink based on pyramidal turbulence structure

As the power of electronic device continues to increase, the heat flux density has also increased accordingly. Good thermal management is an important condition to ensure the safe and stable operation of electronic device. Based on the research results of Hosseinpour, et al and Sharma, et al, a double-layer microchannel heat sink with a pyramidal turbulence structure was designed, the heat transfer capacity of the microchannel heat sink is improved. Deionized water was selected as working medium flow, the double-layer trapezoidal microchannel heat sink model based on the pyramidal turbulence structure was established and analyzed by numerical simulation, the optimized structure size was obtained. The research shows that the microchannel heat sink has better heat transfer performance than other working conditions when the Reynolds number of the microchannel heat sink fluid is near 468, the distance between the disturbing structures is near 300μm, and the bottom-height ratio of the disturbing structure is near 0.6. Under the same conditions which Reynolds number is 800, compared with the results of Sharma, et al, the total heat resistance of the microchannel heat sink is reduced by 26%; compared with the ordinary double-layer trapezoidal microchannel heat sink, the double layer with pyramidal turbulence structure. The enhanced heat transfer coefficient PEC of the double-layer trapezoidal microchannel heat sink with pyramidal turbulence structure is 1.28.