Abstract
In this study, Mo–W–Mo multi-interlayers were used to develop a diffusion bond with SiC-coated three-dimensional (3D) C/SiC composites by spark plasma sintering (SPS). The interfacial microstructure and the phase composition of the joints were investigated. Appropriate interfacial reaction resulted in higher interfacial bonding strengths (shear strength of the joints increased from 56 ± 5 MPa to 83 ± 6 MPa) for joining temperatures (lower than 1600 °C). However, higher joining temperatures (1800 °C) resulted in an excessive growth of interfacial species with high thermal expansion anisotropy (e.g., Mo5Si3 and Mo5Si3C). As a result, the thermal residual stress increase significantly and a large number of interfacial defects were generated, significantly decreasing the reliability of the joints.
| Original language | English |
|---|---|
| Pages (from-to) | 23111-23118 |
| Number of pages | 8 |
| Journal | Ceramics International |
| Volume | 45 |
| Issue number | 17 |
| DOIs | |
| Publication status | Published - 1 Dec 2019 |
| Externally published | Yes |
Keywords
- Joining
- Microstructure
- Refractory metals
- Silicon carbide
- Spark plasma sintering