Fabrication of Continuous Ni Barrier/Seed Layer on Conformal Parylene Liner in TSVs for 3D Packaging and Heterogeneous Integration

Yuwen Su, Yingtao Ding, Han Wang, Shimeng Yan, Yangyang Yan, Ziyue Zhang*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Herein, we demonstrate a low-cost and low-complexity fabrication scheme for TSVs with low-k parylene liner and Ni barrier/seed layer. Two pre-treatment steps are conducted before the formation of the parylene liner by chemical vapor deposition (CVD) and the Ni barrier/seed layer by electroless plating (ELP), respectively. The first one includes the sequential pre-treatments by O2 plasma and a specifically mixed adhesion promotion (AP) solution, which enhances the adhesion between the liner and the substrate. The second one is the surface modification of the parylene liner by a sodium naphthalene solution, which significantly improves the adhesion between Ni and parylene, thus enabling the deposition of a continuous Ni layer in the deep vias. Consequently, TSVs with a diameter of 30 μm and a height of 200 μm are successfully manufactured. This work provides a feasible solution to the demands for low-cost and high-performance TSVs in the 3D packaging and heterogeneous integration applications.

Original languageEnglish
Title of host publication2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350353808
DOIs
Publication statusPublished - 2024
Event25th International Conference on Electronic Packaging Technology, ICEPT 2024 - Tianjin, China
Duration: 7 Aug 20249 Aug 2024

Publication series

Name2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024

Conference

Conference25th International Conference on Electronic Packaging Technology, ICEPT 2024
Country/TerritoryChina
CityTianjin
Period7/08/249/08/24

Keywords

  • electroless plating (ELP)
  • Ni barrier/seed layer
  • parylene liner
  • surface modification
  • TSV

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