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Fabrication and characterization of half-kerfed LiNbO 3-based high-frequency (>100MHz) ultrasonic array transducers

  • J. Y. Zhang
  • , W. J. Xu*
  • , J. Carlier
  • , X. M. Ji
  • , B. Nongaillard
  • , S. Queste
  • , J. Zhou
  • , Y. P. Huang
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The effect of kerf depth is investigated on the performances of array transducers. A finite element tool, COMSOL, is employed to simulate the properties of acoustic field and to calculate the electrical properties of the arrays, including crosstalk effect and electrical impedance. Furthermore, Inductively Coupled Plasma (ICP) deep etching process is used to etch 36°/Y-cut lithium niobate (LiNbO 3) crystals and the limitation of etching aspect ratio is studied. Several arrays with different profiles are realized under optimized processes. At last, arrays with different pitches are fabricated and characterized by a network analyzer.

Original languageEnglish
Title of host publication2011 IEEE International Ultrasonics Symposium, IUS 2011
Pages1727-1730
Number of pages4
DOIs
Publication statusPublished - 2011
Externally publishedYes
Event2011 IEEE International Ultrasonics Symposium, IUS 2011 - Orlando, FL, United States
Duration: 18 Oct 201121 Oct 2011

Publication series

NameIEEE International Ultrasonics Symposium, IUS
ISSN (Print)1948-5719
ISSN (Electronic)1948-5727

Conference

Conference2011 IEEE International Ultrasonics Symposium, IUS 2011
Country/TerritoryUnited States
CityOrlando, FL
Period18/10/1121/10/11

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