TY - GEN
T1 - Fabrication and characterization of half-kerfed LiNbO 3-based high-frequency (>100MHz) ultrasonic array transducers
AU - Zhang, J. Y.
AU - Xu, W. J.
AU - Carlier, J.
AU - Ji, X. M.
AU - Nongaillard, B.
AU - Queste, S.
AU - Zhou, J.
AU - Huang, Y. P.
PY - 2011
Y1 - 2011
N2 - The effect of kerf depth is investigated on the performances of array transducers. A finite element tool, COMSOL, is employed to simulate the properties of acoustic field and to calculate the electrical properties of the arrays, including crosstalk effect and electrical impedance. Furthermore, Inductively Coupled Plasma (ICP) deep etching process is used to etch 36°/Y-cut lithium niobate (LiNbO 3) crystals and the limitation of etching aspect ratio is studied. Several arrays with different profiles are realized under optimized processes. At last, arrays with different pitches are fabricated and characterized by a network analyzer.
AB - The effect of kerf depth is investigated on the performances of array transducers. A finite element tool, COMSOL, is employed to simulate the properties of acoustic field and to calculate the electrical properties of the arrays, including crosstalk effect and electrical impedance. Furthermore, Inductively Coupled Plasma (ICP) deep etching process is used to etch 36°/Y-cut lithium niobate (LiNbO 3) crystals and the limitation of etching aspect ratio is studied. Several arrays with different profiles are realized under optimized processes. At last, arrays with different pitches are fabricated and characterized by a network analyzer.
UR - https://www.scopus.com/pages/publications/84869045311
U2 - 10.1109/ULTSYM.2011.0431
DO - 10.1109/ULTSYM.2011.0431
M3 - Conference contribution
AN - SCOPUS:84869045311
SN - 9781457712531
T3 - IEEE International Ultrasonics Symposium, IUS
SP - 1727
EP - 1730
BT - 2011 IEEE International Ultrasonics Symposium, IUS 2011
T2 - 2011 IEEE International Ultrasonics Symposium, IUS 2011
Y2 - 18 October 2011 through 21 October 2011
ER -