TY - GEN
T1 - Exploring New Interconnection Materials and Techniques for High-Reliability IC Packaging
AU - Zhang, Huizhe
AU - Li, Ce
AU - Fan, Mengzhuo
AU - Zhou, Huanran
AU - Cheng, Xingwang
AU - Ma, Zhaolong
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Accompanied by the increasing electrification and informationization in various devices and equipment, electric circuits (IC) are required to work in complicated and harsh environments. This significantly challenges the reliabilities of interconnections that bear electron current, heat, and mechanical loading. This research focuses on improving the reliability of interconnections serving at high-density current, wide temperature range, and high temperature, by exploring novel materials/techniques including i) βSn structure and orientation control technique, ii) SnGaX full solid-solution (SS) solder alloys, and iii) Sn-CuNi and Ga-Al transient liquid phase bonding (TLPB) technique. Controlling βSn structure and orientation is realized by harnessing the βSn heterogeneous nucleation using seed crystal, and this technique can be applied to Sn-based solder joints to combat reliability problems such as electromigration that is heavily influenced by the βSn orientation. The SnGaX SS solder is a novel patented material that takes advantage of Ga solid solution strengthening to achieve balanced strength and ductility. As opposed to the typical third-generation Pb-free solder Innolot that is too strong to bear plastic deformation, SnGaX SS solder demonstrates a good thermal cycling performance. Sn-CuNi and Ga-Al TLPB provide new solutions for power electronic assembling and they show good mechanical performance and low cost.
AB - Accompanied by the increasing electrification and informationization in various devices and equipment, electric circuits (IC) are required to work in complicated and harsh environments. This significantly challenges the reliabilities of interconnections that bear electron current, heat, and mechanical loading. This research focuses on improving the reliability of interconnections serving at high-density current, wide temperature range, and high temperature, by exploring novel materials/techniques including i) βSn structure and orientation control technique, ii) SnGaX full solid-solution (SS) solder alloys, and iii) Sn-CuNi and Ga-Al transient liquid phase bonding (TLPB) technique. Controlling βSn structure and orientation is realized by harnessing the βSn heterogeneous nucleation using seed crystal, and this technique can be applied to Sn-based solder joints to combat reliability problems such as electromigration that is heavily influenced by the βSn orientation. The SnGaX SS solder is a novel patented material that takes advantage of Ga solid solution strengthening to achieve balanced strength and ductility. As opposed to the typical third-generation Pb-free solder Innolot that is too strong to bear plastic deformation, SnGaX SS solder demonstrates a good thermal cycling performance. Sn-CuNi and Ga-Al TLPB provide new solutions for power electronic assembling and they show good mechanical performance and low cost.
KW - High reliability
KW - orientation
KW - Solid solution
KW - Transient liquid phase bonding
UR - http://www.scopus.com/inward/record.url?scp=85206092754&partnerID=8YFLogxK
U2 - 10.1109/ICEPT63120.2024.10668479
DO - 10.1109/ICEPT63120.2024.10668479
M3 - Conference contribution
AN - SCOPUS:85206092754
T3 - 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024
BT - 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 25th International Conference on Electronic Packaging Technology, ICEPT 2024
Y2 - 7 August 2024 through 9 August 2024
ER -