Exploring New Interconnection Materials and Techniques for High-Reliability IC Packaging

Huizhe Zhang, Ce Li, Mengzhuo Fan, Huanran Zhou, Xingwang Cheng, Zhaolong Ma*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Accompanied by the increasing electrification and informationization in various devices and equipment, electric circuits (IC) are required to work in complicated and harsh environments. This significantly challenges the reliabilities of interconnections that bear electron current, heat, and mechanical loading. This research focuses on improving the reliability of interconnections serving at high-density current, wide temperature range, and high temperature, by exploring novel materials/techniques including i) βSn structure and orientation control technique, ii) SnGaX full solid-solution (SS) solder alloys, and iii) Sn-CuNi and Ga-Al transient liquid phase bonding (TLPB) technique. Controlling βSn structure and orientation is realized by harnessing the βSn heterogeneous nucleation using seed crystal, and this technique can be applied to Sn-based solder joints to combat reliability problems such as electromigration that is heavily influenced by the βSn orientation. The SnGaX SS solder is a novel patented material that takes advantage of Ga solid solution strengthening to achieve balanced strength and ductility. As opposed to the typical third-generation Pb-free solder Innolot that is too strong to bear plastic deformation, SnGaX SS solder demonstrates a good thermal cycling performance. Sn-CuNi and Ga-Al TLPB provide new solutions for power electronic assembling and they show good mechanical performance and low cost.

Original languageEnglish
Title of host publication2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350353808
DOIs
Publication statusPublished - 2024
Event25th International Conference on Electronic Packaging Technology, ICEPT 2024 - Tianjin, China
Duration: 7 Aug 20249 Aug 2024

Publication series

Name2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024

Conference

Conference25th International Conference on Electronic Packaging Technology, ICEPT 2024
Country/TerritoryChina
CityTianjin
Period7/08/249/08/24

Keywords

  • High reliability
  • orientation
  • Solid solution
  • Transient liquid phase bonding

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