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Elimination of scallop-induced stress fluctuation on Through-Silicon-Vias (TSVs) by employing polyimide liner
Chengbo Xue, Zhiqiang Cheng, Zhiming Chen*, Yangyang Yan, Ziru Cai, Yingtao Ding
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
13
Citations
(Scopus)