Electrodeposition Fabrication and Mechanical Properties Study of Ag-Zn Solid Solution Films

Chaoping Wang; Zishan Xiong; Xuefeng Wu; Xiuchen Zhao

doi:10.1109/ICEPT67137.2025.11156974

Electrodeposition Fabrication and Mechanical Properties Study of Ag-Zn Solid Solution Films

Chaoping Wang
, Zishan Xiong
, Xuefeng Wu
, Xiuchen Zhao^*

^*Corresponding author for this work

Beijing Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Ag-Zn exhibits an exceptionally high post-yield plastic deformation capacity, making it a key material for low-temperature, low-pressure solid-state bonding in electronic packaging. Solid-state bonding normally requires metal films thicker than 5 μm to provide enough deformability. Electrodeposition is the preferred method to deposit such films onto chip micro-bumps. We investigated the Ag-Zn electrodeposition process using electrochemical polarization theory. By adjusting bath composition and deposition parameters, we fabricated Ag-Zn films containing 13.83 wt.% Zn. High-resolution STEM analysis revealed Guinier-Preston (GP) zones enriched in Zn within the Ag matrix. Compared with pure Ag films, the Ag-Zn solid-solution coatings showed substantially improved compressive plastic deformability, enabling reliable solid-state bonding of micro-bumps at low pressures.

Original language	English
Title of host publication	2025 26th International Conference on Electronic Packaging Technology, ICEPT 2025
Publisher	Institute of Electrical and Electronics Engineers Inc.
Edition	2025
ISBN (Electronic)	9781665465809
DOIs	https://doi.org/10.1109/ICEPT67137.2025.11156974
Publication status	Published - 2025
Externally published	Yes
Event	26th International Conference on Electronic Packaging Technology, ICEPT 2025 - Shanghai, China Duration: 5 Aug 2025 → 7 Aug 2025

Conference

Conference	26th International Conference on Electronic Packaging Technology, ICEPT 2025
Country/Territory	China
City	Shanghai
Period	5/08/25 → 7/08/25

Keywords

Electrodeposition
Mechanical properties
Molecular dynamics
Solid state bounding

Access to Document

10.1109/ICEPT67137.2025.11156974

Cite this

@inproceedings{d08e1f30e6f2423eb450feae8c07274e,

title = "Electrodeposition Fabrication and Mechanical Properties Study of Ag-Zn Solid Solution Films",

abstract = "Ag-Zn exhibits an exceptionally high post-yield plastic deformation capacity, making it a key material for low-temperature, low-pressure solid-state bonding in electronic packaging. Solid-state bonding normally requires metal films thicker than 5 μm to provide enough deformability. Electrodeposition is the preferred method to deposit such films onto chip micro-bumps. We investigated the Ag-Zn electrodeposition process using electrochemical polarization theory. By adjusting bath composition and deposition parameters, we fabricated Ag-Zn films containing 13.83 wt.\% Zn. High-resolution STEM analysis revealed Guinier-Preston (GP) zones enriched in Zn within the Ag matrix. Compared with pure Ag films, the Ag-Zn solid-solution coatings showed substantially improved compressive plastic deformability, enabling reliable solid-state bonding of micro-bumps at low pressures.",

keywords = "Electrodeposition, Mechanical properties, Molecular dynamics, Solid state bounding",

author = "Chaoping Wang and Zishan Xiong and Xuefeng Wu and Xiuchen Zhao",

note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 26th International Conference on Electronic Packaging Technology, ICEPT 2025 ; Conference date: 05-08-2025 Through 07-08-2025",

year = "2025",

doi = "10.1109/ICEPT67137.2025.11156974",

language = "English",

booktitle = "2025 26th International Conference on Electronic Packaging Technology, ICEPT 2025",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

address = "United States",

edition = "2025",

}

Wang, C, Xiong, Z, Wu, X & Zhao, X 2025, Electrodeposition Fabrication and Mechanical Properties Study of Ag-Zn Solid Solution Films. in 2025 26th International Conference on Electronic Packaging Technology, ICEPT 2025. 2025 edn, Institute of Electrical and Electronics Engineers Inc., 26th International Conference on Electronic Packaging Technology, ICEPT 2025, Shanghai, China, 5/08/25. https://doi.org/10.1109/ICEPT67137.2025.11156974

Electrodeposition Fabrication and Mechanical Properties Study of Ag-Zn Solid Solution Films. / Wang, Chaoping; Xiong, Zishan; Wu, Xuefeng et al.
2025 26th International Conference on Electronic Packaging Technology, ICEPT 2025. 2025. ed. Institute of Electrical and Electronics Engineers Inc., 2025.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Electrodeposition Fabrication and Mechanical Properties Study of Ag-Zn Solid Solution Films

AU - Wang, Chaoping

AU - Xiong, Zishan

AU - Wu, Xuefeng

AU - Zhao, Xiuchen

PY - 2025

Y1 - 2025

N2 - Ag-Zn exhibits an exceptionally high post-yield plastic deformation capacity, making it a key material for low-temperature, low-pressure solid-state bonding in electronic packaging. Solid-state bonding normally requires metal films thicker than 5 μm to provide enough deformability. Electrodeposition is the preferred method to deposit such films onto chip micro-bumps. We investigated the Ag-Zn electrodeposition process using electrochemical polarization theory. By adjusting bath composition and deposition parameters, we fabricated Ag-Zn films containing 13.83 wt.% Zn. High-resolution STEM analysis revealed Guinier-Preston (GP) zones enriched in Zn within the Ag matrix. Compared with pure Ag films, the Ag-Zn solid-solution coatings showed substantially improved compressive plastic deformability, enabling reliable solid-state bonding of micro-bumps at low pressures.

AB - Ag-Zn exhibits an exceptionally high post-yield plastic deformation capacity, making it a key material for low-temperature, low-pressure solid-state bonding in electronic packaging. Solid-state bonding normally requires metal films thicker than 5 μm to provide enough deformability. Electrodeposition is the preferred method to deposit such films onto chip micro-bumps. We investigated the Ag-Zn electrodeposition process using electrochemical polarization theory. By adjusting bath composition and deposition parameters, we fabricated Ag-Zn films containing 13.83 wt.% Zn. High-resolution STEM analysis revealed Guinier-Preston (GP) zones enriched in Zn within the Ag matrix. Compared with pure Ag films, the Ag-Zn solid-solution coatings showed substantially improved compressive plastic deformability, enabling reliable solid-state bonding of micro-bumps at low pressures.

KW - Electrodeposition

KW - Mechanical properties

KW - Molecular dynamics

KW - Solid state bounding

UR - https://www.scopus.com/pages/publications/105030981542

U2 - 10.1109/ICEPT67137.2025.11156974

DO - 10.1109/ICEPT67137.2025.11156974

M3 - Conference contribution

AN - SCOPUS:105030981542

BT - 2025 26th International Conference on Electronic Packaging Technology, ICEPT 2025

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 26th International Conference on Electronic Packaging Technology, ICEPT 2025

Y2 - 5 August 2025 through 7 August 2025

ER -

Electrodeposition Fabrication and Mechanical Properties Study of Ag-Zn Solid Solution Films

Abstract

Conference

Keywords

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