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Effect of wire cutting residual stress on TC4 seeker deformation

  • Wen Yuan Song*
  • , Chun Guang Xu
  • , Pei Lu Li
  • , Lei Wang
  • , Tao Yu
  • , Wei Shi
  • *Corresponding author for this work
  • Beijing Institute of Technology
  • Xi'an Electronic Engineering Research Institute

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Aiming at the problem that the dimension error is difficult to control after wire cutting of TC4 alloy parts, a scheme for measuring the residual stress of TC4 alloy seeker based on ultrasonic critical refraction longitudinal wave method is proposed. The residual stress distribution after wire cutting and the distribution of secondary wire cutting after stress release were measured respectively. Combined with three-coordinate measuring error, the deformation law under different residual stress distribution is analyzed. The results show that the deformation error of seeker can be controlled by reducing the amplitude of residual tensile stress introduced by wire cutting.

Original languageEnglish
Title of host publicationProceedings of 2020 IEEE Far East NDT New Technology and Application Forum, FENDT 2020
EditorsChunguang Xu
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages86-90
Number of pages5
ISBN (Electronic)9781665440820
DOIs
Publication statusPublished - 20 Nov 2020
Event2020 IEEE Far East Forum on Nondestructive Evaluation/Testing: New Technology and Application, FENDT 2020 - Nanjing, China
Duration: 20 Nov 202022 Nov 2020

Publication series

NameProceedings of 2020 IEEE Far East NDT New Technology and Application Forum, FENDT 2020

Conference

Conference2020 IEEE Far East Forum on Nondestructive Evaluation/Testing: New Technology and Application, FENDT 2020
Country/TerritoryChina
CityNanjing
Period20/11/2022/11/20

Keywords

  • Deformation
  • Residual stress
  • TC4
  • Ultrasonic testing

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