TY - GEN
T1 - Effect of spark plasma sintering temperature on microstructures and properties of copper-diamond composites
AU - Khan Niazi, Abdul Rehman
AU - Li, Shukui
AU - Wang, Yingchun
AU - Liu, Jinxu
AU - Hu, Zhiyu
AU - Zahid, Usman
PY - 2013
Y1 - 2013
N2 - Temperature being one of the most important parameters of Spark plasma sintering (SPS) and its effects on the microstructures as well as on the physical properties of copper diamond composites fabricated by mechanical mixing of copper with 70 vol.% diamond powders, precoated with 1 wt% chromium has been studied. Experiments were performed at 900°C, 1000°C and 1100 °C for 10 minutes under 50 MPa. The results reveal that sintering temperature highly influences the copper/diamond interface bonding and microstructures. The composite's properties like thermal conductivity (T.C), specific heat (Cp), diffusivity (Dff) and relative density (ρr) were also highly influenced by temperature variations. Except the relative density, all the other properties increased respectively with increasing sintering temperature.
AB - Temperature being one of the most important parameters of Spark plasma sintering (SPS) and its effects on the microstructures as well as on the physical properties of copper diamond composites fabricated by mechanical mixing of copper with 70 vol.% diamond powders, precoated with 1 wt% chromium has been studied. Experiments were performed at 900°C, 1000°C and 1100 °C for 10 minutes under 50 MPa. The results reveal that sintering temperature highly influences the copper/diamond interface bonding and microstructures. The composite's properties like thermal conductivity (T.C), specific heat (Cp), diffusivity (Dff) and relative density (ρr) were also highly influenced by temperature variations. Except the relative density, all the other properties increased respectively with increasing sintering temperature.
KW - Diamond/copper composites
KW - Diffusivity
KW - Spark plasma sintering
KW - Specific heat
KW - Thermal conductivity
UR - http://www.scopus.com/inward/record.url?scp=84878343351&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.683.573
DO - 10.4028/www.scientific.net/AMR.683.573
M3 - Conference contribution
AN - SCOPUS:84878343351
SN - 9783037856666
T3 - Advanced Materials Research
SP - 573
EP - 576
BT - Advanced Materials and Engineering Materials II
T2 - 2nd International Conference on Advanced Materials and Engineering Materials, ICAMEM 2012
Y2 - 29 December 2012 through 30 December 2012
ER -