Effect of Size-controlled Low-Melting-Point-Alloy Particle-Incorporated on the Reliability of Transient Liquid Phase Epoxy Composite Conductive Adhesive

Chen Liang; Mingkun Yang; Zhiteng Wang; Cheng Wan; Shimeng Xu; Xiaochen Xie; Pengrong Lin; Zhibo Qu; Yong Wang; Xiuchen Zhao; Yongjun Huo; Gang Zhang

doi:10.1109/EPTC62800.2024.10909972

Effect of Size-controlled Low-Melting-Point-Alloy Particle-Incorporated on the Reliability of Transient Liquid Phase Epoxy Composite Conductive Adhesive

Chen Liang
, Mingkun Yang
, Zhiteng Wang
, Cheng Wan
, Shimeng Xu
, Xiaochen Xie
, Pengrong Lin
, Zhibo Qu
, Yong Wang
, Xiuchen Zhao
, Yongjun Huo^*
, Gang Zhang^*

^*Corresponding author for this work

School of Material Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Citation (Scopus)

Abstract

The effect of size-controlled Low-Melting-Point-Alloy (LMPA) particles on the reliability of transient liquid phase epoxy conductive adhesive (TLP-ECA) is discussed. The effects of LMPA particles on resistivity and shear strength were evaluated by high temperature aging (120℃, 1000 h) and high temperature and humidity (85℃, 85%RH, 1000 h) tests. Compared with the traditional Ag-ECA, the resistance of TLP-ECA decreases after high temperature aging, and the shear strength decreases with time, but the overall reliability is better. SEM and TEM analysis revealed that LMPA particles formed a metallurgical bridge with Ag sheets during the curing process, which inhibited crack formation and extension, and increases the contact area with the substrate. This ultimately improves the mechanical integrity, resulting in better electrical, mechanical and thermal stability of TLP-ECA.

Original language	English
Title of host publication	Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024
Editors	Sunmi Shin, Chin Hock Toh, Yeow Kheng Lim, Vivek Chidambaram, King Jien Chui
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	991-996
Number of pages	6
ISBN (Electronic)	9798331522001
DOIs	https://doi.org/10.1109/EPTC62800.2024.10909972
Publication status	Published - 2024
Event	26th Electronics Packaging Technology Conference, EPTC 2024 - Singapore, Singapore Duration: 3 Dec 2024 → 6 Dec 2024

Publication series

Name	Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024

Conference

Conference	26th Electronics Packaging Technology Conference, EPTC 2024
Country/Territory	Singapore
City	Singapore
Period	3/12/24 → 6/12/24

Keywords

ECA
High Humidity
High Temperature
Low-melting-point-alloy
Metallurgical Bridges
Reliability Test
Thermal Aging

Access to Document

10.1109/EPTC62800.2024.10909972

Cite this

Liang, C., Yang, M., Wang, Z., Wan, C., Xu, S., Xie, X., Lin, P., Qu, Z., Wang, Y., Zhao, X., Huo, Y., & Zhang, G. (2024). Effect of Size-controlled Low-Melting-Point-Alloy Particle-Incorporated on the Reliability of Transient Liquid Phase Epoxy Composite Conductive Adhesive. In S. Shin, C. H. Toh, Y. K. Lim, V. Chidambaram, & K. J. Chui (Eds.), Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024 (pp. 991-996). (Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC62800.2024.10909972

Liang, Chen ; Yang, Mingkun ; Wang, Zhiteng et al. / Effect of Size-controlled Low-Melting-Point-Alloy Particle-Incorporated on the Reliability of Transient Liquid Phase Epoxy Composite Conductive Adhesive. Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024. editor / Sunmi Shin ; Chin Hock Toh ; Yeow Kheng Lim ; Vivek Chidambaram ; King Jien Chui. Institute of Electrical and Electronics Engineers Inc., 2024. pp. 991-996 (Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024).

@inproceedings{325471bb81a449b2a5edab0ce6066196,

title = "Effect of Size-controlled Low-Melting-Point-Alloy Particle-Incorporated on the Reliability of Transient Liquid Phase Epoxy Composite Conductive Adhesive",

abstract = "The effect of size-controlled Low-Melting-Point-Alloy (LMPA) particles on the reliability of transient liquid phase epoxy conductive adhesive (TLP-ECA) is discussed. The effects of LMPA particles on resistivity and shear strength were evaluated by high temperature aging (120℃, 1000 h) and high temperature and humidity (85℃, 85\%RH, 1000 h) tests. Compared with the traditional Ag-ECA, the resistance of TLP-ECA decreases after high temperature aging, and the shear strength decreases with time, but the overall reliability is better. SEM and TEM analysis revealed that LMPA particles formed a metallurgical bridge with Ag sheets during the curing process, which inhibited crack formation and extension, and increases the contact area with the substrate. This ultimately improves the mechanical integrity, resulting in better electrical, mechanical and thermal stability of TLP-ECA.",

keywords = "ECA, High Humidity, High Temperature, Low-melting-point-alloy, Metallurgical Bridges, Reliability Test, Thermal Aging",

author = "Chen Liang and Mingkun Yang and Zhiteng Wang and Cheng Wan and Shimeng Xu and Xiaochen Xie and Pengrong Lin and Zhibo Qu and Yong Wang and Xiuchen Zhao and Yongjun Huo and Gang Zhang",

note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 26th Electronics Packaging Technology Conference, EPTC 2024 ; Conference date: 03-12-2024 Through 06-12-2024",

year = "2024",

doi = "10.1109/EPTC62800.2024.10909972",

language = "English",

series = "Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "991--996",

editor = "Sunmi Shin and Toh, \{Chin Hock\} and Lim, \{Yeow Kheng\} and Vivek Chidambaram and Chui, \{King Jien\}",

booktitle = "Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024",

address = "United States",

}

Liang, C, Yang, M, Wang, Z, Wan, C, Xu, S, Xie, X, Lin, P, Qu, Z, Wang, Y, Zhao, X , Huo, Y & Zhang, G 2024, Effect of Size-controlled Low-Melting-Point-Alloy Particle-Incorporated on the Reliability of Transient Liquid Phase Epoxy Composite Conductive Adhesive. in S Shin, CH Toh, YK Lim, V Chidambaram & KJ Chui (eds), Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024. Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024, Institute of Electrical and Electronics Engineers Inc., pp. 991-996, 26th Electronics Packaging Technology Conference, EPTC 2024, Singapore, Singapore, 3/12/24. https://doi.org/10.1109/EPTC62800.2024.10909972

Effect of Size-controlled Low-Melting-Point-Alloy Particle-Incorporated on the Reliability of Transient Liquid Phase Epoxy Composite Conductive Adhesive. / Liang, Chen; Yang, Mingkun; Wang, Zhiteng et al.
Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024. ed. / Sunmi Shin; Chin Hock Toh; Yeow Kheng Lim; Vivek Chidambaram; King Jien Chui. Institute of Electrical and Electronics Engineers Inc., 2024. p. 991-996 (Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Effect of Size-controlled Low-Melting-Point-Alloy Particle-Incorporated on the Reliability of Transient Liquid Phase Epoxy Composite Conductive Adhesive

AU - Liang, Chen

AU - Yang, Mingkun

AU - Wang, Zhiteng

AU - Wan, Cheng

AU - Xu, Shimeng

AU - Xie, Xiaochen

AU - Lin, Pengrong

AU - Qu, Zhibo

AU - Wang, Yong

AU - Zhao, Xiuchen

AU - Huo, Yongjun

AU - Zhang, Gang

PY - 2024

Y1 - 2024

N2 - The effect of size-controlled Low-Melting-Point-Alloy (LMPA) particles on the reliability of transient liquid phase epoxy conductive adhesive (TLP-ECA) is discussed. The effects of LMPA particles on resistivity and shear strength were evaluated by high temperature aging (120℃, 1000 h) and high temperature and humidity (85℃, 85%RH, 1000 h) tests. Compared with the traditional Ag-ECA, the resistance of TLP-ECA decreases after high temperature aging, and the shear strength decreases with time, but the overall reliability is better. SEM and TEM analysis revealed that LMPA particles formed a metallurgical bridge with Ag sheets during the curing process, which inhibited crack formation and extension, and increases the contact area with the substrate. This ultimately improves the mechanical integrity, resulting in better electrical, mechanical and thermal stability of TLP-ECA.

AB - The effect of size-controlled Low-Melting-Point-Alloy (LMPA) particles on the reliability of transient liquid phase epoxy conductive adhesive (TLP-ECA) is discussed. The effects of LMPA particles on resistivity and shear strength were evaluated by high temperature aging (120℃, 1000 h) and high temperature and humidity (85℃, 85%RH, 1000 h) tests. Compared with the traditional Ag-ECA, the resistance of TLP-ECA decreases after high temperature aging, and the shear strength decreases with time, but the overall reliability is better. SEM and TEM analysis revealed that LMPA particles formed a metallurgical bridge with Ag sheets during the curing process, which inhibited crack formation and extension, and increases the contact area with the substrate. This ultimately improves the mechanical integrity, resulting in better electrical, mechanical and thermal stability of TLP-ECA.

KW - ECA

KW - High Humidity

KW - High Temperature

KW - Low-melting-point-alloy

KW - Metallurgical Bridges

KW - Reliability Test

KW - Thermal Aging

UR - https://www.scopus.com/pages/publications/105001324094

U2 - 10.1109/EPTC62800.2024.10909972

DO - 10.1109/EPTC62800.2024.10909972

M3 - Conference contribution

AN - SCOPUS:105001324094

T3 - Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024

SP - 991

EP - 996

BT - Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024

A2 - Shin, Sunmi

A2 - Toh, Chin Hock

A2 - Lim, Yeow Kheng

A2 - Chidambaram, Vivek

A2 - Chui, King Jien

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 26th Electronics Packaging Technology Conference, EPTC 2024

Y2 - 3 December 2024 through 6 December 2024

ER -

Liang C, Yang M, Wang Z, Wan C, Xu S, Xie X et al. Effect of Size-controlled Low-Melting-Point-Alloy Particle-Incorporated on the Reliability of Transient Liquid Phase Epoxy Composite Conductive Adhesive. In Shin S, Toh CH, Lim YK, Chidambaram V, Chui KJ, editors, Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024. Institute of Electrical and Electronics Engineers Inc. 2024. p. 991-996. (Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024). doi: 10.1109/EPTC62800.2024.10909972

Effect of Size-controlled Low-Melting-Point-Alloy Particle-Incorporated on the Reliability of Transient Liquid Phase Epoxy Composite Conductive Adhesive

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