TY - GEN
T1 - Effect of pad shape on electromigration in solder bump joints
AU - Li, Yi
AU - Chan, Y. C.
AU - Zhao, Xiuchen
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/11/18
Y1 - 2014/11/18
N2 - In this study, the effect of pad shape on current density and temperature distributions in solder joints has been investigated by three dimensional thermo-electrical finite element analysis. The simulation results show that square, hexagonal, octagonal and rounded pads with the same thickness/volume generate different current density and temperature distributions. The maximum current densities in solder bumps are 2.81×104, 2.62×104, 2.60×104 and 2.66×104 A/cm2 respectively, while the maximum temperatures are 183.3, 181.5, 181.2 and 182.2°C respectively. Solder joints with octagonal pads generate the smallest current density and temperature, indicating that this geometry has the best electromigration reliability. The results indicate that electromigration reliability can be improved by changing pad shape, without enlarging joint size. Pad shape design is a promising solder joint structure design method for enhancement of electromigration reliability in line with the miniaturization trends of future electronic products. Better design of the pad structure should help alleviate the electromigration reliability problem.
AB - In this study, the effect of pad shape on current density and temperature distributions in solder joints has been investigated by three dimensional thermo-electrical finite element analysis. The simulation results show that square, hexagonal, octagonal and rounded pads with the same thickness/volume generate different current density and temperature distributions. The maximum current densities in solder bumps are 2.81×104, 2.62×104, 2.60×104 and 2.66×104 A/cm2 respectively, while the maximum temperatures are 183.3, 181.5, 181.2 and 182.2°C respectively. Solder joints with octagonal pads generate the smallest current density and temperature, indicating that this geometry has the best electromigration reliability. The results indicate that electromigration reliability can be improved by changing pad shape, without enlarging joint size. Pad shape design is a promising solder joint structure design method for enhancement of electromigration reliability in line with the miniaturization trends of future electronic products. Better design of the pad structure should help alleviate the electromigration reliability problem.
UR - https://www.scopus.com/pages/publications/84918548763
U2 - 10.1109/ESTC.2014.6962849
DO - 10.1109/ESTC.2014.6962849
M3 - Conference contribution
AN - SCOPUS:84918548763
T3 - ESTC 2014 - 5th Electronics System-Integration Technology Conference
BT - ESTC 2014 - 5th Electronics System-Integration Technology Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 5th Electronics System-Integration Technology Conference, ESTC 2014
Y2 - 16 September 2014 through 18 September 2014
ER -