Effect of graphene on thermal and mechanical properties of copper-titanium carbide composites

  • Faisal Nazeer
  • , Zhuang Ma
  • , Lihong Gao*
  • , Abdul Malik
  • , Muhammad Abubaker Khan
  • , Sehrish Abrar
  • , Bilal Ahmed
  • , Fuchi Wang
  • , Hezhang Li
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

The good interface bonding is the basic requirement of metal-graphene composites to improve their mechanical properties. Here, we fabricated the hybrid composites through traditional powder metallurgy method. SEM and XRD were conducted to elaborate the microstructure and crystal orientation of powder as well as bulk composites. Tensile and hardness test was carried out to check the effect of graphene on copper-titanium carbide composite. Titanium carbide/copper-graphene (0.1 wt%) composite have excellent yield strength, ultimate strength and hardness higher than pure copper and also from copper-titanium carbide composite. The thermal conductivity values and anisotropic thermal conductivity ratio of titanium carbide/copper-graphene (0.1 wt%) composite are also far better than pure Cu. The results of mechanical and thermal properties demonstrate that these materials can be a better candidate to use in the thermal packaging system.

Original languageEnglish
Article number109100
JournalVacuum
Volume173
DOIs
Publication statusPublished - Mar 2020

Keywords

  • Cu–Ti composite
  • Hardness
  • Interface bonding
  • Thermal conductivity
  • TiC/Cu-G hybrid composite
  • Yield strength

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