Effect of electroless nickel of aluminum substrate on the thermal shock resistance of TBCs

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	21
Number of pages	1
Journal	Cailiao Gongcheng/Journal of Materials Engineering
Issue number	3
Publication status	Published - Mar 2003

Cite this

@article{f508038047b94e11a47b5c073fc3af70,

title = "Effect of electroless nickel of aluminum substrate on the thermal shock resistance of TBCs",

author = "Zhuang Ma and Lu, \{Guang Shu\} and Wang, \{Fu Chi\} and Quansheng Wang and Wang, \{Ying Chun\}",

year = "2003",

month = mar,

language = "English",

pages = "21",

journal = "Cailiao Gongcheng/Journal of Materials Engineering",

issn = "1001-4381",

publisher = "Science Press",

number = "3",

}

TY - JOUR

T1 - Effect of electroless nickel of aluminum substrate on the thermal shock resistance of TBCs

AU - Ma, Zhuang

AU - Lu, Guang Shu

AU - Wang, Fu Chi

AU - Wang, Quansheng

AU - Wang, Ying Chun

PY - 2003/3

Y1 - 2003/3

UR - https://www.scopus.com/pages/publications/0038160035

M3 - Article

AN - SCOPUS:0038160035

SN - 1001-4381

SP - 21

JO - Cailiao Gongcheng/Journal of Materials Engineering

JF - Cailiao Gongcheng/Journal of Materials Engineering

IS - 3

ER -