Effect of curing pressure on the curing behavior of an epoxy system: Curing kinetics and simulation verification

Qun Liang; Xi Ping Feng; Kun Zhang; Xue Mei Hui; Xiao Hou; Jin Rui Ye

doi:10.1016/j.polymer.2022.125162

Effect of curing pressure on the curing behavior of an epoxy system: Curing kinetics and simulation verification

Qun Liang, Xi Ping Feng, Kun Zhang, Xue Mei Hui, Xiao Hou^*, Jin Rui Ye^*

^*Corresponding author for this work

School of Aerospace Engineering

Research output: Contribution to journal › Article › peer-review

15 Citations (Scopus)

Abstract

Most composites require a certain amount of pressure to cure, therefore, it is crucial to comprehend the effect of pressure on the curing reaction. Nonetheless, the majority of studies on curing reaction focus on isothermal or non-isothermal DSC measurements at ambient pressure. Using a high-pressure differential calorimetry scanner (Netzsch DSC 204HP), the curing process of a bisphenol A diglycidyl ether system is studied in order to evaluate the influence of curing pressure. The results indicate a competitive relationship between the effect of heating rate and pressure on the reaction rate, with the influence of heating rate being stronger. The reaction follows the autocatalytic model, and the average activation energy E_P and pre-exponential factor A_P decrease as the pressure increases. The obtained kinetics are used to simulate the process of forming composite laminates. When the thickness of laminates exceeds 18 mm, the maximum difference of the temperature and curing degree between ambient pressure and 2 MPa pressure is 20.65 °C and 0.161, respectively, indicating that the simulation results of thick composites are affected by whether the curing pressure is considered in kinetics.

Original language	English
Article number	125162
Journal	Polymer
Volume	256
DOIs	https://doi.org/10.1016/j.polymer.2022.125162
Publication status	Published - 21 Sept 2022

Keywords

Autocatalytic model
Curing kinetics
Epoxy
High-pressure differential calorimetry scanner
Pressure

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10.1016/j.polymer.2022.125162

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@article{a5a41919b67147369cf116f6f69cdc18,

title = "Effect of curing pressure on the curing behavior of an epoxy system: Curing kinetics and simulation verification",

abstract = "Most composites require a certain amount of pressure to cure, therefore, it is crucial to comprehend the effect of pressure on the curing reaction. Nonetheless, the majority of studies on curing reaction focus on isothermal or non-isothermal DSC measurements at ambient pressure. Using a high-pressure differential calorimetry scanner (Netzsch DSC 204HP), the curing process of a bisphenol A diglycidyl ether system is studied in order to evaluate the influence of curing pressure. The results indicate a competitive relationship between the effect of heating rate and pressure on the reaction rate, with the influence of heating rate being stronger. The reaction follows the autocatalytic model, and the average activation energy EP and pre-exponential factor AP decrease as the pressure increases. The obtained kinetics are used to simulate the process of forming composite laminates. When the thickness of laminates exceeds 18 mm, the maximum difference of the temperature and curing degree between ambient pressure and 2 MPa pressure is 20.65 °C and 0.161, respectively, indicating that the simulation results of thick composites are affected by whether the curing pressure is considered in kinetics.",

keywords = "Autocatalytic model, Curing kinetics, Epoxy, High-pressure differential calorimetry scanner, Pressure",

author = "Qun Liang and Feng, {Xi Ping} and Kun Zhang and Hui, {Xue Mei} and Xiao Hou and Ye, {Jin Rui}",

note = "Publisher Copyright: {\textcopyright} 2022 Elsevier Ltd",

year = "2022",

month = sep,

day = "21",

doi = "10.1016/j.polymer.2022.125162",

language = "English",

volume = "256",

journal = "Polymer",

issn = "0032-3861",

publisher = "Elsevier B.V.",

}

TY - JOUR

T1 - Effect of curing pressure on the curing behavior of an epoxy system

T2 - Curing kinetics and simulation verification

AU - Liang, Qun

AU - Feng, Xi Ping

AU - Zhang, Kun

AU - Hui, Xue Mei

AU - Hou, Xiao

AU - Ye, Jin Rui

PY - 2022/9/21

Y1 - 2022/9/21

N2 - Most composites require a certain amount of pressure to cure, therefore, it is crucial to comprehend the effect of pressure on the curing reaction. Nonetheless, the majority of studies on curing reaction focus on isothermal or non-isothermal DSC measurements at ambient pressure. Using a high-pressure differential calorimetry scanner (Netzsch DSC 204HP), the curing process of a bisphenol A diglycidyl ether system is studied in order to evaluate the influence of curing pressure. The results indicate a competitive relationship between the effect of heating rate and pressure on the reaction rate, with the influence of heating rate being stronger. The reaction follows the autocatalytic model, and the average activation energy EP and pre-exponential factor AP decrease as the pressure increases. The obtained kinetics are used to simulate the process of forming composite laminates. When the thickness of laminates exceeds 18 mm, the maximum difference of the temperature and curing degree between ambient pressure and 2 MPa pressure is 20.65 °C and 0.161, respectively, indicating that the simulation results of thick composites are affected by whether the curing pressure is considered in kinetics.

AB - Most composites require a certain amount of pressure to cure, therefore, it is crucial to comprehend the effect of pressure on the curing reaction. Nonetheless, the majority of studies on curing reaction focus on isothermal or non-isothermal DSC measurements at ambient pressure. Using a high-pressure differential calorimetry scanner (Netzsch DSC 204HP), the curing process of a bisphenol A diglycidyl ether system is studied in order to evaluate the influence of curing pressure. The results indicate a competitive relationship between the effect of heating rate and pressure on the reaction rate, with the influence of heating rate being stronger. The reaction follows the autocatalytic model, and the average activation energy EP and pre-exponential factor AP decrease as the pressure increases. The obtained kinetics are used to simulate the process of forming composite laminates. When the thickness of laminates exceeds 18 mm, the maximum difference of the temperature and curing degree between ambient pressure and 2 MPa pressure is 20.65 °C and 0.161, respectively, indicating that the simulation results of thick composites are affected by whether the curing pressure is considered in kinetics.

KW - Autocatalytic model

KW - Curing kinetics

KW - Epoxy

KW - High-pressure differential calorimetry scanner

KW - Pressure

UR - http://www.scopus.com/inward/record.url?scp=85135405006&partnerID=8YFLogxK

U2 - 10.1016/j.polymer.2022.125162

DO - 10.1016/j.polymer.2022.125162

M3 - Article

AN - SCOPUS:85135405006

SN - 0032-3861

VL - 256

JO - Polymer

JF - Polymer

M1 - 125162

ER -

Effect of curing pressure on the curing behavior of an epoxy system: Curing kinetics and simulation verification

Abstract

Keywords

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