Skip to main navigation Skip to search Skip to main content

Effect of Compaction Processing on Residual Stress in Molded Sulfur-Based Components

  • Lin Wang*
  • , Chunguang Xu
  • , Xiaowei Guo
  • , Zekai Wang
  • *Corresponding author for this work
  • Beijing Institute of Technology
  • Inner Mongolia University of Technology
  • Ltd
  • Chinese Weapons Science Academy Ningbo Branch

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

To address crack initiation and deformation in sulfur-bonded propellant rings caused by concentrated residual stress during compression molding, high-energy ultrasonic vibration was integrated into the compaction process for in-situ stress modulation. Residual stress was non-destructively quantified using the critical refracted longitudinal (LCR) wave time-of-flight method. The effects of molding parameters and ultrasonic excitation on stress distribution and structural integrity were systematically examined across specimens with varying densities. A calibrated stress coefficient of 0.254 was obtained for the batch, with all density groups showing no detectable cracks or porosity, confirming the efficacy of the optimized formulation and processing route. Ultrasonic-assisted molding reduced peak residual stress by 25-40%, while higher-density specimens exhibited more uniform hoop stress distributions with elevated magnitudes. The results reveal a synergistic interaction between material density and process parameters in tailoring the internal stress field, offering mechanistic insights and practical strategies for precision molding sulfur-based energetic composites. The proposed approach provides a viable framework for residual stress management in thermoset polymer systems for defense applications.

Original languageEnglish
Title of host publicationProceedings of 2025 IEEE Far East NDT New Technology and Application Forum, FENDT 2025
EditorsChunguang Xu
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages202-206
Number of pages5
ISBN (Electronic)9798331503413
DOIs
Publication statusPublished - 2025
Externally publishedYes
Event2025 IEEE Far East NDT New Technology and Application Forum, FENDT 2025 - Wuhan, China
Duration: 23 Jun 202526 Jun 2025

Publication series

NameProceedings of 2025 IEEE Far East NDT New Technology and Application Forum, FENDT 2025

Conference

Conference2025 IEEE Far East NDT New Technology and Application Forum, FENDT 2025
Country/TerritoryChina
CityWuhan
Period23/06/2526/06/25

Keywords

  • compaction molding
  • high-energy ultrasound
  • non-destructive testing manufacturing systems
  • residual stress
  • sulfur

Fingerprint

Dive into the research topics of 'Effect of Compaction Processing on Residual Stress in Molded Sulfur-Based Components'. Together they form a unique fingerprint.

Cite this