@inproceedings{434e6b56f2144f38ad93039c6c5a9d32,
title = "Effect of Compaction Processing on Residual Stress in Molded Sulfur-Based Components",
abstract = "To address crack initiation and deformation in sulfur-bonded propellant rings caused by concentrated residual stress during compression molding, high-energy ultrasonic vibration was integrated into the compaction process for in-situ stress modulation. Residual stress was non-destructively quantified using the critical refracted longitudinal (LCR) wave time-of-flight method. The effects of molding parameters and ultrasonic excitation on stress distribution and structural integrity were systematically examined across specimens with varying densities. A calibrated stress coefficient of 0.254 was obtained for the batch, with all density groups showing no detectable cracks or porosity, confirming the efficacy of the optimized formulation and processing route. Ultrasonic-assisted molding reduced peak residual stress by 25-40\%, while higher-density specimens exhibited more uniform hoop stress distributions with elevated magnitudes. The results reveal a synergistic interaction between material density and process parameters in tailoring the internal stress field, offering mechanistic insights and practical strategies for precision molding sulfur-based energetic composites. The proposed approach provides a viable framework for residual stress management in thermoset polymer systems for defense applications.",
keywords = "compaction molding, high-energy ultrasound, non-destructive testing manufacturing systems, residual stress, sulfur",
author = "Lin Wang and Chunguang Xu and Xiaowei Guo and Zekai Wang",
note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 2025 IEEE Far East NDT New Technology and Application Forum, FENDT 2025 ; Conference date: 23-06-2025 Through 26-06-2025",
year = "2025",
doi = "10.1109/FENDT66689.2025.11547504",
language = "English",
series = "Proceedings of 2025 IEEE Far East NDT New Technology and Application Forum, FENDT 2025",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "202--206",
editor = "Chunguang Xu",
booktitle = "Proceedings of 2025 IEEE Far East NDT New Technology and Application Forum, FENDT 2025",
address = "United States",
}