Designing extreme-ultraviolet lithographic objective for 11 nm node

Zhen Cao, Yanqiu Li*, Fei Liu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

Extreme ultraviolet (EUV) lithography is one of the most promising technologies for 11 nm node. In this paper, a six-mirror objective system with a higher numerical aperture (NA) 0.5 and a central obscuration was designed with grouping design method. Some key issues about grouping design and control of obscuration were discussed in detail. Design result shows that the size of obscuration is smaller than 30% radius of the pupil and the composite Root-Mean-Square (RMS) wavefront error can reach 0.029 λ (λ=13.5 nm) in a 13 mm×1 mm ring field. Design of this six-mirror objective system provides a potential solution for 11 nm node of EUV lithography.

Original languageEnglish
Title of host publicationExtreme Ultraviolet (EUV) Lithography V
PublisherSPIE
ISBN (Print)9780819499714
DOIs
Publication statusPublished - 2014
EventExtreme Ultraviolet (EUV) Lithography V - San Jose, CA, United States
Duration: 24 Feb 201427 Feb 2014

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9048
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceExtreme Ultraviolet (EUV) Lithography V
Country/TerritoryUnited States
CitySan Jose, CA
Period24/02/1427/02/14

Keywords

  • EUV lithography
  • grouping design
  • high-NA
  • lithographic objective
  • six-mirror system

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