Design of multi-band microstrip power dividers

Qing Xin Chu*, Feng Lin

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)

Abstract

A survey of design methods of multi-band microstrip power dividers is presented. It can be found that the basis of multi-band power divider design is the design of multi-band impedance transformers. In fact, the quarter-wavelength transmission lines are usually used directly to realize multi-band power divider. Another design approach of a multi-band power divider is to attach an impedance transformer to each port of its junction, in which the impedance transformer transforms the equivalent admittance of a three-port junction to normalized unit conductance at multiple-frequencies. Some multi-band power dividers including a novel dual-band or broadband Gysel power dividers are discussed.

Original languageEnglish
Title of host publication2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
DOIs
Publication statusPublished - 2011
Externally publishedYes
Event2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011 - Hanzhou, China
Duration: 12 Dec 201114 Dec 2011

Publication series

Name2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011

Conference

Conference2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
Country/TerritoryChina
CityHanzhou
Period12/12/1114/12/11

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