Design and Testing of MEMS Metal Bridge Solid State Switch

Hengzhen Feng; Wenzhong Lou; Xuran Ding; Fuquan Zheng; Maohao Liao

doi:10.1109/NEMS.2019.8915643

Design and Testing of MEMS Metal Bridge Solid State Switch

Hengzhen Feng, Wenzhong Lou, Xuran Ding, Fuquan Zheng, Maohao Liao

School of Mechatronical Engineering

Beijing Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

In this paper, a MEMS metal bridge solid-state switch with small size, good consistency, safety and controllability is developed. The MEMS micro-Actuator designed a planar structure. There is a metal bridge structure in the device. Due to the characteristics of the metal bridge structure, the high current pulse drive signal tends to generate a large amount of Joule heat at the bridge structure of the device. In order to understand the possible failure conditions of the device, this paper analyzes the effect of such Joule heat inside the device, carries out related theoretical calculations, and uses COMSOL to complete the failure simulation analysis. At the same time, this paper has carried out reliability research on chip manufacturing, packaging and soldering process through wafer level test and device level test, and optimized the structure design. Finally, the processing and packaging of the device MEMS metal bridge solid state switch is realized.

Original language	English
Title of host publication	Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	122-127
Number of pages	6
ISBN (Electronic)	9781728116297
DOIs	https://doi.org/10.1109/NEMS.2019.8915643
Publication status	Published - Apr 2019
Event	14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019 - Bangkok, Thailand Duration: 11 Apr 2019 → 14 Apr 2019

Publication series

Name	Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019

Conference

Conference	14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019
Country/Territory	Thailand
City	Bangkok
Period	11/04/19 → 14/04/19

Keywords

Device level test
Failure simulation analysis
MEMS metal bridge solid-state switch
MEMS micro-Actuator

Access to Document

10.1109/NEMS.2019.8915643

Cite this

Feng, H., Lou, W., Ding, X., Zheng, F., & Liao, M. (2019). Design and Testing of MEMS Metal Bridge Solid State Switch. In Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019 (pp. 122-127). Article 8915643 (Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2019.8915643

Feng, Hengzhen ; Lou, Wenzhong ; Ding, Xuran et al. / Design and Testing of MEMS Metal Bridge Solid State Switch. Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 122-127 (Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019).

@inproceedings{4a198e621b404f4b911b5f1d9bddf6d4,

title = "Design and Testing of MEMS Metal Bridge Solid State Switch",

abstract = "In this paper, a MEMS metal bridge solid-state switch with small size, good consistency, safety and controllability is developed. The MEMS micro-Actuator designed a planar structure. There is a metal bridge structure in the device. Due to the characteristics of the metal bridge structure, the high current pulse drive signal tends to generate a large amount of Joule heat at the bridge structure of the device. In order to understand the possible failure conditions of the device, this paper analyzes the effect of such Joule heat inside the device, carries out related theoretical calculations, and uses COMSOL to complete the failure simulation analysis. At the same time, this paper has carried out reliability research on chip manufacturing, packaging and soldering process through wafer level test and device level test, and optimized the structure design. Finally, the processing and packaging of the device MEMS metal bridge solid state switch is realized.",

keywords = "Device level test, Failure simulation analysis, MEMS metal bridge solid-state switch, MEMS micro-Actuator",

author = "Hengzhen Feng and Wenzhong Lou and Xuran Ding and Fuquan Zheng and Maohao Liao",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019 ; Conference date: 11-04-2019 Through 14-04-2019",

year = "2019",

month = apr,

doi = "10.1109/NEMS.2019.8915643",

language = "English",

series = "Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "122--127",

booktitle = "Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019",

address = "United States",

}

Feng, H , Lou, W, Ding, X, Zheng, F & Liao, M 2019, Design and Testing of MEMS Metal Bridge Solid State Switch. in Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019., 8915643, Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019, Institute of Electrical and Electronics Engineers Inc., pp. 122-127, 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019, Bangkok, Thailand, 11/04/19. https://doi.org/10.1109/NEMS.2019.8915643

Design and Testing of MEMS Metal Bridge Solid State Switch. / Feng, Hengzhen ; Lou, Wenzhong; Ding, Xuran et al.
Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 122-127 8915643 (Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Design and Testing of MEMS Metal Bridge Solid State Switch

AU - Feng, Hengzhen

AU - Lou, Wenzhong

AU - Ding, Xuran

AU - Zheng, Fuquan

AU - Liao, Maohao

PY - 2019/4

Y1 - 2019/4

N2 - In this paper, a MEMS metal bridge solid-state switch with small size, good consistency, safety and controllability is developed. The MEMS micro-Actuator designed a planar structure. There is a metal bridge structure in the device. Due to the characteristics of the metal bridge structure, the high current pulse drive signal tends to generate a large amount of Joule heat at the bridge structure of the device. In order to understand the possible failure conditions of the device, this paper analyzes the effect of such Joule heat inside the device, carries out related theoretical calculations, and uses COMSOL to complete the failure simulation analysis. At the same time, this paper has carried out reliability research on chip manufacturing, packaging and soldering process through wafer level test and device level test, and optimized the structure design. Finally, the processing and packaging of the device MEMS metal bridge solid state switch is realized.

AB - In this paper, a MEMS metal bridge solid-state switch with small size, good consistency, safety and controllability is developed. The MEMS micro-Actuator designed a planar structure. There is a metal bridge structure in the device. Due to the characteristics of the metal bridge structure, the high current pulse drive signal tends to generate a large amount of Joule heat at the bridge structure of the device. In order to understand the possible failure conditions of the device, this paper analyzes the effect of such Joule heat inside the device, carries out related theoretical calculations, and uses COMSOL to complete the failure simulation analysis. At the same time, this paper has carried out reliability research on chip manufacturing, packaging and soldering process through wafer level test and device level test, and optimized the structure design. Finally, the processing and packaging of the device MEMS metal bridge solid state switch is realized.

KW - Device level test

KW - Failure simulation analysis

KW - MEMS metal bridge solid-state switch

KW - MEMS micro-Actuator

UR - http://www.scopus.com/inward/record.url?scp=85076709966&partnerID=8YFLogxK

U2 - 10.1109/NEMS.2019.8915643

DO - 10.1109/NEMS.2019.8915643

M3 - Conference contribution

AN - SCOPUS:85076709966

T3 - Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019

SP - 122

EP - 127

BT - Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019

Y2 - 11 April 2019 through 14 April 2019

ER -

Feng H , Lou W, Ding X, Zheng F, Liao M. Design and Testing of MEMS Metal Bridge Solid State Switch. In Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 122-127. 8915643. (Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019). doi: 10.1109/NEMS.2019.8915643

Design and Testing of MEMS Metal Bridge Solid State Switch

Abstract

Publication series

Conference

Keywords

Access to Document

Other files and links

Fingerprint

Cite this