Design and Simulation of a Novel Integrated Opto-Electronic Through-Glass-Via (TGV) Structure for Co-Packaged Optics (CPO) Applications

Co-packaged optics (CPO) technology has emerged as an effective solution to realizing multi-functional opto-electronic integrated systems with minimized footprint and excellent performance. In traditional CPO systems, the electrical and optical signals between stacked device layers typically rely on separate vertical interconnections, increasing the manufacturing complexity and cost. This study proposes an integrated opto-electronic through-glass-via (TGV) structure, which combines annular Cu electrical path with benzocyclobutene (BCB) and spin-on-glass (SOG) optical waveguide in a single via to enable simultaneous opto-electronic transmission. Finite-difference time-domain (FDTD) simulations demonstrate that the proposed structure achieves a transmission loss of only 0.52 dB in the standard case. Notably, the TGV structure exhibits strong tolerance to variations in structural parameters like sidewall shape and alignment offset. This design offers a cost-effective and high-efficiency opto-electronic interconnection solution for the advanced CPO applications.