Defect pattern recognition on Nano/Micro Integrated Circuits Wafer

Xian Zhao; Lirong Cui

doi:10.1109/NEMS.2008.4484385

Defect pattern recognition on Nano/Micro Integrated Circuits Wafer

Xian Zhao^*, Lirong Cui

^*Corresponding author for this work

Beijing Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

7 Citations (Scopus)

Abstract

Defects on Nano/Micro Integrated Circuits Wafer (ICW) tend to cluster and the spatial patterns of these defect clusters usually contain important information for quality engineers to remove the root causes of failures. In this paper, a new method consisting of noise filter, defect clustering by using chameleon method and model-based pattern recognition is proposed for automatic defect spatial pattern recognition on Nano/Micro ICW. The new method can not only find the number of defect clusters, and identify the pattern of each cluster, but also provide valuable information for the yield and reliability study. The method can recognize not only the linear/curvilinear patterns, ellipsoidal patterns, but also the ring spatial patterns.

Original language	English
Title of host publication	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
Pages	519-523
Number of pages	5
DOIs	https://doi.org/10.1109/NEMS.2008.4484385
Publication status	Published - 2008
Event	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China Duration: 6 Jan 2008 → 9 Jan 2008

Publication series

Name	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS

Conference

Conference	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
Country/Territory	China
City	Sanya
Period	6/01/08 → 9/01/08

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10.1109/NEMS.2008.4484385

Cite this

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title = "Defect pattern recognition on Nano/Micro Integrated Circuits Wafer",

abstract = "Defects on Nano/Micro Integrated Circuits Wafer (ICW) tend to cluster and the spatial patterns of these defect clusters usually contain important information for quality engineers to remove the root causes of failures. In this paper, a new method consisting of noise filter, defect clustering by using chameleon method and model-based pattern recognition is proposed for automatic defect spatial pattern recognition on Nano/Micro ICW. The new method can not only find the number of defect clusters, and identify the pattern of each cluster, but also provide valuable information for the yield and reliability study. The method can recognize not only the linear/curvilinear patterns, ellipsoidal patterns, but also the ring spatial patterns.",

author = "Xian Zhao and Lirong Cui",

year = "2008",

doi = "10.1109/NEMS.2008.4484385",

language = "English",

isbn = "9781424419081",

series = "3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS",

pages = "519--523",

booktitle = "3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008",

note = "3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 ; Conference date: 06-01-2008 Through 09-01-2008",

}

Zhao, X & Cui, L 2008, Defect pattern recognition on Nano/Micro Integrated Circuits Wafer. in 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008., 4484385, 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS, pp. 519-523, 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008, Sanya, China, 6/01/08. https://doi.org/10.1109/NEMS.2008.4484385

Defect pattern recognition on Nano/Micro Integrated Circuits Wafer. / Zhao, Xian; Cui, Lirong.
3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008. 2008. p. 519-523 4484385 (3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Cui, Lirong

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N2 - Defects on Nano/Micro Integrated Circuits Wafer (ICW) tend to cluster and the spatial patterns of these defect clusters usually contain important information for quality engineers to remove the root causes of failures. In this paper, a new method consisting of noise filter, defect clustering by using chameleon method and model-based pattern recognition is proposed for automatic defect spatial pattern recognition on Nano/Micro ICW. The new method can not only find the number of defect clusters, and identify the pattern of each cluster, but also provide valuable information for the yield and reliability study. The method can recognize not only the linear/curvilinear patterns, ellipsoidal patterns, but also the ring spatial patterns.

AB - Defects on Nano/Micro Integrated Circuits Wafer (ICW) tend to cluster and the spatial patterns of these defect clusters usually contain important information for quality engineers to remove the root causes of failures. In this paper, a new method consisting of noise filter, defect clustering by using chameleon method and model-based pattern recognition is proposed for automatic defect spatial pattern recognition on Nano/Micro ICW. The new method can not only find the number of defect clusters, and identify the pattern of each cluster, but also provide valuable information for the yield and reliability study. The method can recognize not only the linear/curvilinear patterns, ellipsoidal patterns, but also the ring spatial patterns.

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U2 - 10.1109/NEMS.2008.4484385

DO - 10.1109/NEMS.2008.4484385

M3 - Conference contribution

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T3 - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS

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BT - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008

T2 - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008

Y2 - 6 January 2008 through 9 January 2008

ER -

Defect pattern recognition on Nano/Micro Integrated Circuits Wafer

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