Abstract
The continued scaling of integrated transistors faces fundamental limitations, primarily due to severe gate leakage and reliability degradation at sub-nanometer dielectric thicknesses. High-quality, wide-bandgap high-κ dielectrics are therefore essential to enable further device miniaturization and energy-efficient operation. Here, we report the synthesis of a novel hexagonal δ′-tantalum pentoxide (δ′-Ta2O5) via a molten-salt-assisted chemical vapor deposition (CVD) method combined with a spatial confinement strategy. This material exhibits single-crystalline characteristics with an exceptionally high dielectric constant (κ ≈ 42.8), a large breakdown field (>7.23 MV cm−1), and a wide bandgap (∼3.78 eV). When integrated as a top-gate dielectric in graphene and molybdenum disulfide (MoS2) field-effect transistors (FETs), δ′-Ta2O5 enables outstanding device performance: an equivalent oxide thickness (EOT) as low as 2.03 nm, a near-Boltzmann-limit subthreshold swing of 62.4 mV dec−1, and gate leakage currents on the order of 10−6 A cm−2. These results establish δ′-Ta2O5 as a promising high-κ dielectric platform for low-power, high-performance electronics beyond the silicon scaling roadmap.
| Original language | English |
|---|---|
| Pages (from-to) | 1914-1921 |
| Number of pages | 8 |
| Journal | ACS Materials Letters |
| Volume | 8 |
| Issue number | 7 |
| DOIs | |
| Publication status | Published - 6 Jul 2026 |
| Externally published | Yes |
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