Abstract
To improve the heat resistance of Escherichia coli, an inducible heat-resistance device T7-T.te-HSP20 and a constitutive heat-resistance device gapA-T. te-HSP20 based on T. te-HSP20 gene from Thermoanaerobacter tengcongensis MB4, and corresponding engineered strains E. coli-TH and E. coli-GH were constructed. The targeted protein was expressed in solubility after IPTG induction at 30℃ in E. coli-TH. Meanwhile, the survival rate of E. coli-TH was 3.2 times higher than the control at 50℃ for 30 min. The result of high-temperature fermentation showed that the optimum temperature range of E. coli-GH was broadened (37-43℃) under the regulation of heat resistance device gapA-T. te-HSP20. Stress resistance analysis showed that E. coli-GH not only possessed heat resistance and butanol resistance, but also had some resistance to acetic acid and ethanol. These results provide a new idea for modern microorganisms industry.
| Original language | English |
|---|---|
| Pages (from-to) | 3128-3135 |
| Number of pages | 8 |
| Journal | Huagong Xuebao/CIESC Journal |
| Volume | 65 |
| Issue number | 8 |
| DOIs | |
| Publication status | Published - 1 Aug 2014 |
Keywords
- Escherichia coli
- Heat resistance
- Heat shock protein (HSP)
- Stress resistance
- Survival rate
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