Comparative study on the hourglass-like joint of electroplated Sn-base solder reinforced by adding Ag3Sn nanoparticles and Ag micro-alloying elements

Zhuangzhuang Hou, Xiuchen Zhao*, Ying Liu, Chengwen Tan, Yue Gu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

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Material Science