CMOS MEMS Thermal Flow Sensor with Enhanced Sensitivity for Heating, Ventilation, and Air Conditioning Application

Wei Xu*, Xiaoyi Wang, Ruijie Wang, Izhar, Jingcui Xu, Yi Kuen Lee

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

43 Citations (Scopus)

Abstract

In this article, by using 0.35-μm two-polysilicon four-metal CMOS MEMS technology, a thermoresistive micro calorimetric flow (TMCF) sensor with two packaging designs is systematically investigated: Open-space (O-Type) and probe-with-channel (P-Type) designs. In comparison with the O-Type design, the P-Type sensor shows an 80% enhanced sensitivity with a relieved tilt angle effect on the mainstream airflow detection. Accordingly, the P-Type packaged flow sensor for HVAC gains a prominent normalized sensitivity (S∗) of 228 μV/(m/s)/mW, while also having a low power consumption (P) of less than 4.2 mW. Moreover, within the linear range of-2 to 2 m/s, an accuracy of ±0.05 m/s is achieved, thus enabling this robust flow sensor (repeatability <0.2%) for indoor airflow measurements even in a variable ambient environment. Furthermore, the proposed P-Type TMCF sensor and its wireless multisensor module are applied for the development of personalized ventilation and the monitoring of predicted mean vote, both of which confirm the functionality of the developed sensor for indoor airflow measurements in the HVAC system.

Original languageEnglish
Article number9063438
Pages (from-to)4468-4476
Number of pages9
JournalIEEE Transactions on Industrial Electronics
Volume68
Issue number5
DOIs
Publication statusPublished - May 2021
Externally publishedYes

Keywords

  • Complementary metal-oxide-semiconductor (CMOS) microelectromechanical systems (MEMS)
  • indoor airflow measurement
  • packaging design
  • thermal flow sensor
  • thermoresistive

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