TY - GEN
T1 - Capillary condensation adhesion phenomena and analysis of the micromechanical gyroscope
AU - He, Yunli
AU - Liu, Haipeng
AU - Gao, Shiqiao
AU - Wang, Caifeng
PY - 2013
Y1 - 2013
N2 - In MEMS, the size of micro-structure is usually in the micron and even nanoscale. It's easier to form capillary phenomenon than the macroscopic system. In view of this phenomenon, this article is based on the micro-mechanical gyroscope as the research object, to analyze the occurrence of capillary condensation of adhesion phenomenon. Firstly, we derive the Kelvin equation for capillary condensation, and then combination of the Kelvin equation introduce the capillary condensation of the adhesion phenomenon; Secondly, it analyzes the dynamics characteristics of its structure existing the liquid bridge, and analyzes the causes of the liquid bridge; Finally, it analyzes the capillary adhesion phenomena on the performance of the micro-mechanical gyroscope, as well as how to avoid the generation of capillary condensation adhesion.
AB - In MEMS, the size of micro-structure is usually in the micron and even nanoscale. It's easier to form capillary phenomenon than the macroscopic system. In view of this phenomenon, this article is based on the micro-mechanical gyroscope as the research object, to analyze the occurrence of capillary condensation of adhesion phenomenon. Firstly, we derive the Kelvin equation for capillary condensation, and then combination of the Kelvin equation introduce the capillary condensation of the adhesion phenomenon; Secondly, it analyzes the dynamics characteristics of its structure existing the liquid bridge, and analyzes the causes of the liquid bridge; Finally, it analyzes the capillary adhesion phenomena on the performance of the micro-mechanical gyroscope, as well as how to avoid the generation of capillary condensation adhesion.
KW - Capillary condensation adhesion phenomena
KW - Kelvin equation
KW - Liquid bridge
KW - MEMS
UR - https://www.scopus.com/pages/publications/84883670327
U2 - 10.4028/www.scientific.net/KEM.562-565.251
DO - 10.4028/www.scientific.net/KEM.562-565.251
M3 - Conference contribution
AN - SCOPUS:84883670327
SN - 9783037857397
T3 - Key Engineering Materials
SP - 251
EP - 254
BT - Micro-Nano Technology XIV
PB - Trans Tech Publications Ltd.
T2 - 14th Annual Conference and the 3rd International Conference of the Chinese Society of Micro-Nano Technology, CSMNT 2012
Y2 - 4 November 2012 through 7 November 2012
ER -