Author Reply to “Comment on “Inhibitory effect of low-angle grain boundaries on the creep behavior of gradient nano-grained Cu: A molecular dynamics study” by L. Hao et al.” (DOI: 10.1016/j.mtcomm.2024.110963)

Leilei Hao; Dongping Chen; Xujia Hou; He Yang; Aiguo Pi

doi:10.1016/j.mtcomm.2026.115175

Author Reply to “Comment on “Inhibitory effect of low-angle grain boundaries on the creep behavior of gradient nano-grained Cu: A molecular dynamics study” by L. Hao et al.” (DOI: 10.1016/j.mtcomm.2024.110963)

Leilei Hao
, Dongping Chen^*
, Xujia Hou
, He Yang
, Aiguo Pi^*

^*Corresponding author for this work

Beijing Institute of Technology
China Academy of Engineering Physics

Research output: Contribution to journal › Letter › peer-review

Original language	English
Article number	115175
Journal	Materials Today Communications
Volume	54
DOIs	https://doi.org/10.1016/j.mtcomm.2026.115175
Publication status	Published - Jun 2026
Externally published	Yes

Access to Document

10.1016/j.mtcomm.2026.115175

Cite this

Hao, L., Chen, D., Hou, X., Yang, H., & Pi, A. (2026). Author Reply to “Comment on “Inhibitory effect of low-angle grain boundaries on the creep behavior of gradient nano-grained Cu: A molecular dynamics study” by L. Hao et al.” (DOI: 10.1016/j.mtcomm.2024.110963). Materials Today Communications, 54, Article 115175. https://doi.org/10.1016/j.mtcomm.2026.115175

@article{25f2097425dd49fbacb2012f9b0b58db,

title = "Author Reply to “Comment on “Inhibitory effect of low-angle grain boundaries on the creep behavior of gradient nano-grained Cu: A molecular dynamics study” by L. Hao et al.” (DOI: 10.1016/j.mtcomm.2024.110963)",

author = "Leilei Hao and Dongping Chen and Xujia Hou and He Yang and Aiguo Pi",

year = "2026",

month = jun,

doi = "10.1016/j.mtcomm.2026.115175",

language = "English",

volume = "54",

journal = "Materials Today Communications",

issn = "2352-4928",

publisher = "Elsevier Ltd.",

}

Author Reply to “Comment on “Inhibitory effect of low-angle grain boundaries on the creep behavior of gradient nano-grained Cu: A molecular dynamics study” by L. Hao et al.” (DOI: 10.1016/j.mtcomm.2024.110963). / Hao, Leilei; Chen, Dongping; Hou, Xujia et al.
In: Materials Today Communications, Vol. 54, 115175, 06.2026.

Research output: Contribution to journal › Letter › peer-review

TY - JOUR

T1 - Author Reply to “Comment on “Inhibitory effect of low-angle grain boundaries on the creep behavior of gradient nano-grained Cu

T2 - A molecular dynamics study” by L. Hao et al.” (DOI: 10.1016/j.mtcomm.2024.110963)

AU - Hao, Leilei

AU - Chen, Dongping

AU - Hou, Xujia

AU - Yang, He

AU - Pi, Aiguo

PY - 2026/6

Y1 - 2026/6

UR - https://www.scopus.com/pages/publications/105040919655

U2 - 10.1016/j.mtcomm.2026.115175

DO - 10.1016/j.mtcomm.2026.115175

M3 - Letter

AN - SCOPUS:105040919655

SN - 2352-4928

VL - 54

JO - Materials Today Communications

JF - Materials Today Communications

M1 - 115175

ER -

Author Reply to “Comment on “Inhibitory effect of low-angle grain boundaries on the creep behavior of gradient nano-grained Cu: A molecular dynamics study” by L. Hao et al.” (DOI: 10.1016/j.mtcomm.2024.110963)

Access to Document

Other files and links

Cite this